Nozzle, and substrate processing apparatus
Abstract
A nozzle for discharging droplets of a processing liquid for processing a substrate has a main body including a supply port, a drain port, a processing liquid flow passageway connecting the supply port and the drain port, and a plurality of discharge ports from which the processing liquid is discharged. The processing liquid flow passageway includes a plurality of branch flow channels, which branch out between the supply port and the drain port and collect together between the supply port and the drain port. The plurality of discharge ports form a plurality of columns respectively corresponding to the plurality of branch flow channels; and are aligned along and connected to the corresponding branch flow channels. A piezo element applies vibration to the processing liquid flowing through the plurality of branch flow channels.
Claims
exact text as granted — not AI-modified1 . A nozzle arranged to discharge droplets of a processing liquid for processing a substrate, the nozzle comprising:
a main body; and a piezo element; the main body including: a supply port supplied with the processing liquid; a drain port from which the processing liquid supplied to the supply port is drained; a processing liquid flow passageway connecting the supply port and the drain port, the processing liquid flow passageway including a plurality of branch flow channels branching out between the supply port and the drain port and collecting together between the supply port and the drain port; and a plurality of discharge ports forming a plurality of columns respectively corresponding to the plurality of branch flow channels, being aligned along the corresponding branch flow channels, and being connected to the corresponding branch flow channels; the piezo element arranged to apply vibration to the processing liquid flowing through the plurality of branch flow channels.
2 . The nozzle according to claim 1 , wherein the main body is formed of a material containing quartz.
3 . The nozzle according to claim 1 , further comprising:
a wiring connected to the piezo element; and a cover covering a both the piezo element and the wiring therewithin.
4 . The nozzle according to claim 1 , wherein the main body further includes:
connection channels connecting the branch flow channels and the discharge ports; and each of the connection channels includes: a reduced portion that reduces in flow path area as the discharge port is approached.
5 . The nozzle according to claim 4 , wherein the processing liquid flow passageway and the connection channels are arranged in an interior of the main body, and the main body includes a plurality of divided bodies that are joined to each other.
6 . A substrate processing apparatus comprising:
a substrate holding unit arranged to hold a substrate; a nozzle arranged to discharge droplets of a processing liquid toward the substrate held by the substrate holding unit; a processing liquid supply unit arranged to supply the processing liquid to a supply port of the nozzle; and a voltage applying unit arranged to apply voltage to a piezo element of the nozzle; the nozzle including: a main body and the piezo element; the main body including: the supply port supplied with the processing liquid; a drain port from which the processing liquid supplied to the supply port is drained; a processing liquid flow passageway connecting the supply port and the drain port, the processing liquid flow passageway including a plurality of branch flow channels branching out between the supply port and the drain port and collecting together between the supply port and the drain port; and a plurality of discharge ports forming a plurality of columns respectively corresponding to the plurality of branch flow channels, being aligned along the corresponding branch flow channels, and being connected to the corresponding branch flow channels; the piezo element arranged to apply vibration to the processing liquid flowing through the plurality of branch flow channels.
7 . The substrate processing apparatus according to claim 6 , further comprising a nozzle moving unit being arranged to move the nozzle along a locus, wherein the locus extends along a major surface of the substrate held by the substrate holding unit and passes through a center of the major surface when viewed from a perpendicular direction perpendicular to the major surface, and holding the nozzle so that the plurality of columns formed by the plurality of discharge ports intersect the locus when viewed from the perpendicular direction.
8 . The substrate processing apparatus according to claim 7 , further comprising a control unit arranged to control the nozzle moving unit to move the nozzle along the locus so that, between a central position at which the nozzle overlaps with the center of the major surface when viewed from the perpendicular direction and a peripheral edge position at which the nozzle overlaps with a peripheral edge of the major surface when viewed from the perpendicular direction, the plurality of columns overlap successively with the center of the major surface when viewed from the perpendicular direction.
9 . (canceled)
10 . A substrate processing apparatus comprising:
a substrate holding and rotating unit that is arranged to hold and rotate a substrate; a nozzle having disposed therein a plurality of columns, in each of which a plurality of discharge ports discharging droplets of a processing liquid are aligned in a single column, and arranged to discharge the droplets of the processing liquid toward the substrate held by the substrate holding and rotating unit; and a nozzle holding and moving unit being arranged to move the nozzle along a locus, wherein the locus passes through a rotation center of a major surface of the substrate held by the substrate holding and rotating unit when viewed from a perpendicular direction perpendicular to the major surface, and being arranged to hold the nozzle so that the plurality of columns intersect the locus when viewed from the perpendicular direction.
11 . The substrate processing apparatus according to claim 10 , further comprising;
a control unit arranged to control the nozzle holding and moving unit to move the nozzle along the locus so that, between a central position at which the nozzle overlaps with the rotation center of the major surface when viewed from the perpendicular direction and a peripheral edge position at which the nozzle overlaps with a peripheral edge of the major surface when viewed from the perpendicular direction, the plurality of columns overlap successively with the rotation center of the major surface when viewed from the perpendicular direction.
12 . The substrate processing apparatus according to claim 10 , wherein
the nozzle includes: a main body having processing liquid flow channels, which are connected to the discharge ports and in which the processing liquid flows through along the columns, provided in respective correspondence to each of the plurality of columns; and a piezo element arranged to apply vibration to the processing liquid flowing through the processing liquid flow channels; and the substrate processing apparatus further comprises: a voltage applying unit that is arranged to apply voltage to the piezo element.
13 - 14 . (canceled)Join the waitlist — get patent alerts
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