Polishing pad, polishing apparatus and method for manufacturing polishing pad

Abstract

The present invention relates to a polishing pad comprising a foaming resin frame and a plurality of auxiliary fiber filaments, and each of the auxiliary fiber filaments is independent and dispersed randomly in the foaming resin frame. The invention also relates to a polishing apparatus and a method for manufacturing the polishing pad.

What is claimed is: 
     
         1 . A polishing pad comprising:
 a foaming resin frame comprising a plurality of holes; and   a plurality of auxiliary fiber filaments, wherein each of the auxiliary fiber filaments is independent and dispersed randomly in the foaming resin frame.   
     
     
         2 . The polishing pad according to  claim 1 , wherein the foaming resin frame comprises at least one selected from the group consisting of polyurethane, polyolefin, polycarbonate, polyvinyl alcohol, nylon, elastic rubber, polystyrene, polyaromatic molecules, fluorine-containing polymer, polyidmide, cross-linked polyurethane, cross-linked polyolefin, polyether, polyester, polyacrylate, elastic polyethylene, polytetrafluoroethylene, poly(ethylene terephthalate), polyaromatic amide, polyarylalkene, polymethyl methacrylate, a copolymer thereof, a block copolymer thereof, a mixture thereof, and a blend thereof. 
     
     
         3 . The polishing pad according to  claim 1 , wherein each of a plurality of holes is independent. 
     
     
         4 . The polishing pad according to  claim 1 , wherein the length of the auxiliary fiber filaments is from about 0.1 mm to about 1.0 mm. 
     
     
         5 . The polishing pad according to  claim 1 , wherein the thickness of the auxiliary fiber filaments is from about 2 denier to about 5 denier. 
     
     
         6 . The polishing pad according to  claim 1 , wherein the ratio of the auxiliary fiber filaments is from about 1% to about 30% by weight. 
     
     
         7 . The polishing pad according to  claim 1 , wherein the auxiliary fiber filaments are made from at least one selected from the group consisting of polyamide, p-phenylenediamine, polyester, polymethyl methacrylate, polyethylene terephthalate and polyacrylonitrile. 
     
     
         8 . The polishing pad according to  claim 1 , wherein a plurality of the auxiliary fiber filaments protrude from a surface of the foaming resin frame. 
     
     
         9 . The polishing pad according to  claim 1 , wherein further comprises a plurality of polishing particles which are dispersed randomly in the foaming resin frame. 
     
     
         10 . A polishing apparatus comprising:
 a polishing plate;   a substrate;   the polishing pad according to  claim 1 , which is adhered on the polishing plate for polishing the substrate; and   a slurry contacting with the substrate for polishing.   
     
     
         11 . The polishing apparatus according to  claim 10 , wherein the foaming resin frame comprises at least one selected from the group consisting of polyurethane, polyolefin, polycarbonate, polyvinyl alcohol, nylon, elastic rubber, polystyrene, polyaromatic molecules, fluorine-containing polymer, polyidmide, cross-linked polyurethane, cross-linked polyolefin, polyether, polyester, polyacrylate, elastic polyethylene, polytetrafluoroethylene, poly(ethylene terephthalate), polyaromatic amide, polyarylalkene, polymethyl methacrylate, a copolymer thereof, a block copolymer thereof, a mixture thereof, and a blend thereof. 
     
     
         12 . The polishing apparatus according to  claim 10 , wherein each of a plurality of holes is independent. 
     
     
         13 . The polishing apparatus according to  claim 10 , wherein the length of the auxiliary fiber filaments is from about 0.1 mm to about 1.0 mm. 
     
     
         14 . The polishing apparatus according to  claim 10 , wherein the thickness of the auxiliary fiber filaments is from about 2 denier to about 5 denier. 
     
     
         15 . The polishing apparatus according to  claim 10 , wherein the ratio of the auxiliary fiber filaments is from about 1% to about 30% by weight. 
     
     
         16 . The polishing apparatus according to  claim 10 , wherein the auxiliary fiber filaments are made from at least one selected from the group consisting of polyamide, p-phenylenediamine, polyester, polymethyl methacrylate, polyethylene terephthalate and polyacrylonitrile. 
     
     
         17 . The polishing apparatus according to  claim 10 , wherein a plurality of the auxiliary fiber filaments protrude from a surface of the foaming resin frame. 
     
     
         18 . The polishing apparatus according to  claim 10 , wherein further comprises a plurality of polishing particles which are dispersed randomly in the foaming resin frame. 
     
     
         19 . A method for manufacturing the polishing pad according to  claim 1  comprising:
 (a) providing a carrier, wherein the carrier is a releasing material; 
 (b) providing a foaming resin composition; 
 (c) providing a plurality of auxiliary fiber filaments; 
 (d) randomly dispersing the auxiliary fiber filaments of the step (c) in the foaming resin composition of the step (b); 
 (e) coating the foaming resin composition randomly dispersed with the auxiliary fiber filaments of the step (d) on the carrier of the step (a); and 
 (f) curing the foaming resin composition of the step (e). 
 
     
     
         20 . The method according to  claim 19 , wherein the carrier comprises a polyethylene glycol terephthalate film, a polypropylene film, a polycarbonate film, a polyethylene film, a polyethylene terephthalate film, a release releasing paper or a release releasing fabric. 
     
     
         21 . The method according to  claim 19 , wherein the carrier is continuously provided. 
     
     
         22 . A method for manufacturing the polishing pad according to  claim 1  comprising:
 (a) providing a mold; 
 (b) providing a foaming resin composition; 
 (c) providing a plurality of auxiliary fiber filaments; 
 (d) randomly dispersing the auxiliary fiber filaments of the step (c) in the foaming resin composition of the step (b); 
 (e) filling the foaming resin composition randomly dispersed with the auxiliary fiber filaments randomly of the step (d) in a cavity of the mold (a); 
 (f) curing the foaming resin composition of the step (e); and 
 (g) slicing the cured foaming resin composition of the step (f) for obtaining the polishing pad.