Led illumination module

Abstract

Provided is a light emitting diode (LED) illumination module. The LED illumination module includes a fluorescent substance plate mounted to be capable of being attached to and detached from an opening formed in a top surface of a heat sink. Also, the LED illumination module includes a lens that covers the opening of the heat sink and is mounted to be capable of being attached to and detached from the heat sink.

1 . A light emitting diode (LED) illumination module, comprising:
 a heat sink comprising an opening in a top surface of the heat sink and a recess unit formed in a bottom surface of the opening, the recess unit having a smaller width than the opening;   an LED package comprising an LED chip disposed within the recess unit;   a fluorescent substance plate detachably disposed in the opening; and   a lens covering the opening and disposed on the heat sink.   
     
     
         2 . The LED illumination module of  claim 1 , wherein the LED chip is spaced from the fluorescent substance plate. 
     
     
         3 . The LED illumination module of  claim 2 , wherein the distance between the LED chip and the fluorescent substance plate is defined by a depth of the recess unit. 
     
     
         4 . The LED illumination module of  claim 1 , further comprising an optical plate detachably disposed in the opening. 
     
     
         5 . The LED illumination module of  claim 4 , wherein the optical plate comprises a light diffuser plate or a dichroic filter. 
     
     
         6 . The LED illumination module of  claim 1 , wherein the lens is detachably disposed on the heat sink. 
     
     
         7 . The LED illumination module of  claim 6 , wherein:
 a groove unit corresponding to an outer circumferential shape of the heat sink is formed in a lower portion of the lens; and   the heat sink is disposed in the groove unit.   
     
     
         8 . The LED illumination module of  claim 6 , wherein the lens is spirally connected with the heat sink. 
     
     
         9 . The LED illumination module of  claim 6 , wherein:
 an insertion groove is formed in a bottom surface of the lens or a top surface of the heat sink;   an insertion protrusion is formed in the bottom surface of the lens or the top surface of the heat sink, opposite to the insertion groove; and   the insertion groove and the insertion protrusion are detachably connected.   
     
     
         10 . The LED illumination module of  claim 1 , wherein a central portion of the lens comprises a total reflection surface having a V sectional shape. 
     
     
         11 . The LED illumination module of  claim 1 , wherein the LED package comprises:
 an LED chip disposed on a circuit substrate disposed in the recess unit; and   an encapsulation unit covering the LED chip.   
     
     
         12 . The LED illumination module of  claim 8 , wherein:
 a screw groove corresponding to an inner circumferential edge of the lens is formed on an upper portion of the heat sink;   a screw protrusion corresponding to an outer circumferential edge of the heat sink is formed on a lower portion of the lens; and   the screw groove and the screw protrusion are detachably connected.