Conductive metal enhanced with conductive nanomaterial

Abstract

Electroplating systems and methods are provided that employ a structure for defining a zone of deposition for co-depositing metal and nanomaterial on a cathode. Materials that may be co-deposited include copper and carbon nanotubes Pulsed power may be employed to produce a more dimensionally uniform and/or more functionally uniform deposit.

1 .- 29 . (canceled) 
     
     
         30 . A system for electroplating comprising a cathode onto which material can be deposited, an anode spaced apart from the cathode, and a structure between the cathode and the anode for defining a deposition zone therebetween, wherein the material for deposition onto the cathode includes a metal and nanomaterial. 
     
     
         31 . The system of  claim 30  wherein the metal is copper and the nanomaterial is carbon nanotubes. 
     
     
         32 . The system of  claim 30 , wherein a structure is provided for feeding nanomaterial into the deposition zone. 
     
     
         33 . The system of  claim 32 , wherein the structure is configured for dosing nanomaterial into the deposition zone. 
     
     
         34 . The system of  claim 32 , wherein the structure includes a frame with a plurality of spaced-apart openings through which nanomaterial can flow to the deposition zone. 
     
     
         35 . The system of  claim 32 , wherein the structure has filter material impermeable to the nanomaterial. 
     
     
         36 . The system of  claim 32 , wherein the structure has membrane material impermeable to the nanomaterial. 
     
     
         37 . The system of  claim 30 , further comprising a recirculating pump system for recirculating the material to the deposition zone. 
     
     
         38 . The system of  claim 30 , further comprising a dosing system for providing the nanomaterial to the structure in doses. 
     
     
         39 . The system of  claim 38  wherein a chosen total amount of nanomaterial is introduced into the deposition zone and the dosing system supplies about two percent of the chosen total amount of nanomaterial every minute. 
     
     
         40 . The system of  claim 30 , further comprising a vessel, the vessel having an interior wall,
 the cathode having a reverse side which does not define any part of the deposition zone,   the reverse side of the cathode located against, or a relatively short distance from, the interior wall of the vessel so there is little or no voltage differential on the cathode's backside so that little or no plating occurs on the reverse side.   
     
     
         41 . The system of  claim 30 , further comprising a power system for periodically supplying power to the system so that material is non-continuously deposited on the cathode. 
     
     
         42 . The system of  claim 41  wherein the power system is configured to pulse the power for a period that is one of:
 about twenty milliseconds and then the power is reversed for about two milliseconds to reverse the electric field; 
 about twenty-five milliseconds and then the power is reversed for about five milliseconds to reverse the electric field; 
 about forty milliseconds and then the power is reversed for about six milliseconds to reverse the electric field; and 
 about thirty milliseconds and then the power is reversed for about five milliseconds to reverse the electric field. 
 
     
     
         43 . The system of  claim 41 , configured so that periodically supplying power produces a wider zone of nucleation to affect smoothing of portions of a deposit in a deposition layer on the cathode in or near a zone of nucleation on the cathode. 
     
     
         44 . The system of  claim 30  wherein the nanomaterial is one of or includes electrically conductive nanomaterial, carbon nanotubes, and single-walled carbon nanotubes, and further comprising a power system for periodically supplying power to the system so that an electric field is pulsed between the cathode and the anode so that material is non-continuously deposited on the cathode. 
     
     
         45 . A thing made by the system of  claim 30 . 
     
     
         46 . The thing of  claim 45  which is one of circuit board, circuit board for printed circuit motor, electrical contact, cylinder, bar, tube, and plate. 
     
     
         47 . A method for making a plated product, comprising
 introducing an electroplating bath into a vessel of a system, the system comprising a cathode onto which material can be deposited, an anode spaced apart from the cathode, and a structure between the cathode and the anode for defining a deposition zone therebetween, wherein the material for deposition onto the cathode includes a metal and nanomaterial, and   electroplating the cathode using the system.   
     
     
         48 . The method of  claim 47 , further comprising smoothing a surface of a layer deposited at the cathode by pulsing power to the system. 
     
     
         49 . The method of  claim 48 , further comprising smoothing a surface of a layer deposited at the cathode by controlling the zone of nucleation at the cathode with inhibiting, leveling, or grain refining chemicals.