Microelectronic packages with leadframes, including leadframes configured for stacked die packages, and associated systems and methods

Abstract

Microelectronic packages with leadframes, including leadframes configured for stacked die packages, and associated systems and methods are disclosed. A system in accordance with one embodiment includes a support member having first package bond sites electrically coupled to leadframe bond sites. A microelectronic die can be carried by the support member and electrically coupled to the first packaged bond sites. A leadframe can be attached to the leadframe bond sites so as to extend adjacent to the microelectronic die, with the die positioned between the leadframe and the support member. The leadframe can include second package bond sites facing away from the first package bond sites. An encapsulant can at least partially surround the leadframe and the microelectronic die, with the first and second package bond sites accessible from outside the encapsulant.

We claim: 
     
         1 . A leadframe for electrical coupling to a microelectronic die, comprising:
 a conductive frame; and   a plurality of conductive leadfingers connected to and extending inwardly from the frame, individual leadfingers having a leadfinger surface facing in a first direction and located in a leadfinger plane, the individual leadfingers further having an electrically conductive bond site with a bonding surface that is offset away from the leadfinger plane in the first direction.   
     
     
         2 . The leadframe of  claim 1  wherein the leadfinger surface is a first leadfinger surface facing in the first direction, and wherein the individual leadfingers have a second leadfinger surface facing opposite from the first leadfinger surface, the second leadfinger surface being generally flat and uniform. 
     
     
         3 . The leadframe of  claim 1  wherein the conductive bond site and the bonding surface are integral elements of the leadfingers. 
     
     
         4 . The leadframe of  claim 1  wherein the conductive frame forms an enclosed region within which the leadfingers are positioned. 
     
     
         5 . The leadframe of  claim 1 , further comprising electrically conductive couplers attached to individual bond sites. 
     
     
         6 . The leadframe of  claim 5  wherein the conductive couplers include solder balls.