Bipolar transistor, semiconductor device, and bipolar transistor manufacturing method
Abstract
Disconnection of a base line is suppressed even when a short-side direction of a collector layer is parallel to crystal orientation [011]. A bipolar transistor includes: a collector layer that has a long-side direction and a short-side direction in a plan view, in which the short-side direction is parallel to crystal orientation [011], a cross-section perpendicular to the short-side direction has an inverted mesa shape, and a cross-section perpendicular to the long-side direction has a forward mesa shape; a base layer that is formed on the collector layer; a base electrode that is formed on the base layer; and a base line that is connected to the base electrode and that is drawn out from an end in the short-side direction of the collector layer to the outside of the collector layer in a plan view.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A bipolar transistor comprising:
a collector layer that has a long-side direction and a short-side direction in a plan view, wherein the short-side direction is parallel to crystal orientation [011], a cross-section perpendicular to the short-side direction has an inverted mesa shape, and a cross-section perpendicular to the long-side direction has a forward mesa shape; a base layer that is formed on the collector layer; a base electrode that is formed on the base layer; and a base line that is connected to the base electrode and that is drawn out from an end in the short-side direction of the collector layer to the outside of the collector layer in a plan view.
2 . The bipolar transistor according to claim 1 , wherein the base line is drawn out to be oblique about the short-side direction of the collector layer in a plan view.
3 . The bipolar transistor according to claim 1 , wherein the base layer has a long-side direction and a short-side direction in a plan view and the base layer has the same crystal orientation as the collector layer has, the short-side direction of the base layer is parallel to crystal orientation [011], a cross-section perpendicular to the short-side direction of the base layer has an inverted mesa shape, and a cross-section perpendicular to the long-side direction of the base layer has a forward mesa shape.
4 . The bipolar transistor according to claim 1 further comprising a sub collector layer that is formed between a substrate and the collector layer, the crystal orientation of the sub collector layer being the same as the crystal orientation of the collector layer, wherein a cross-section perpendicular to the short-side direction of the collector layer has an inverted mesa shape, and a cross-section perpendicular to the long-side direction of the collector layer has a forward mesa shape.
5 . The bipolar transistor according to claim 4 , wherein the substrate is a GaAs substrate.
6 . A semiconductor device comprising:
a first bipolar transistor which is the bipolar transistor according to claim 1 ; and a second bipolar transistor including a second collector layer that has a long-side direction and a short-side direction in a plan view, wherein the long-side direction of the second collector layer is parallel to crystal orientation [011], a cross-section perpendicular to the short-side direction of the second collector layer has an inverted mesa shape, and a cross-section perpendicular to the long-side direction of the second collector layer has a forward mesa shape, a second base layer that is formed on the second collector layer, a second base electrode that is formed on the second base layer, and a second base line that is connected to the second base electrode and that is drawn out from an end in the long-side direction of the second collector layer to the outside of the second collector layer in a plan view.
7 . A bipolar transistor manufacturing method comprising the steps of:
forming a collector layer and a base layer on a substrate; wet-etching the collector layer and the base layer so that a short-side direction of the collector layer in a plan view is parallel to crystal orientation [011] of the collector layer; forming a base electrode on the base layer; and forming a base line, which is connected to the base electrode and is drawn out from an end of the collector layer in the short-side direction of the collector layer to the outside of the collector layer in a plan view, using a physical vapor deposition method.
8 . The bipolar transistor according to claim 2 , wherein the base layer has a long-side direction and a short-side direction in a plan view and the base layer has the same crystal orientation as the collector layer has, the short-side direction of the base layer is parallel to crystal orientation [011], a cross-section perpendicular to the short-side direction of the base layer has an inverted mesa shape, and a cross-section perpendicular to the long-side direction of the base layer has a forward mesa shape.
9 . The bipolar transistor according to claim 2 further comprising a sub collector layer that is formed between a substrate and the collector layer and that has the same crystal orientation as the collector layer has, wherein a cross-section perpendicular to the short-side direction of the collector layer has an inverted mesa shape, and a cross-section perpendicular to the long-side direction of the collector layer has a forward mesa shape.
10 . The bipolar transistor according to claim 3 further comprising a sub collector layer that is formed between a substrate and the collector layer, the crystal orientation of the sub collector layer being the same as the crystal orientation of the collector layer, wherein a cross-section perpendicular to the short-side direction of the collector layer has an inverted mesa shape, and a cross-section perpendicular to the long-side direction of the collector layer has a forward mesa shape.
11 . A semiconductor device comprising:
a first bipolar transistor which is the bipolar transistor according to claim 2 ; and a second bipolar transistor including a second collector layer that has a long-side direction and a short-side direction in a plan view, wherein the long-side direction of the second collector layer is parallel to crystal orientation [011], a cross-section perpendicular to the short-side direction of the second collector layer has an inverted mesa shape, and a cross-section perpendicular to the long-side direction of the second collector layer has a forward mesa shape, a second base layer that is formed on the second collector layer, a second base electrode that is formed on the second base layer, and a second base line that is connected to the second base electrode and that is drawn out from an end in the long-side direction of the second collector layer to the outside of the second collector layer in a plan view.
12 . A semiconductor device comprising:
a first bipolar transistor which is the bipolar transistor according to claim 3 ; and a second bipolar transistor including a second collector layer that has a long-side direction and a short-side direction in a plan view, wherein the long-side direction of the second collector layer is parallel to crystal orientation [011], a cross-section perpendicular to the short-side direction of the second collector layer has an inverted mesa shape, and a cross-section perpendicular to the long-side direction of the second collector layer has a forward mesa shape, a second base layer that is formed on the second collector layer, a second base electrode that is formed on the second base layer, and a second base line that is connected to the second base electrode and that is drawn out from an end in the long-side direction of the second collector layer to the outside of the second collector layer in a plan view.
13 . A semiconductor device comprising:
a first bipolar transistor which is the bipolar transistor according to claim 4 ; and a second bipolar transistor including a second collector layer that has a long-side direction and a short-side direction in a plan view, wherein the long-side direction of the second collector layer is parallel to crystal orientation [011], a cross-section perpendicular to the short-side direction of the second collector layer has an inverted mesa shape, and a cross-section perpendicular to the long-side direction of the second collector layer has a forward mesa shape, a second base layer that is formed on the second collector layer, a second base electrode that is formed on the second base layer, and a second base line that is connected to the second base electrode and that is drawn out from an end in the long-side direction of the second collector layer to the outside of the second collector layer in a plan view.
14 . A semiconductor device comprising:
a first bipolar transistor which is the bipolar transistor according to claim 5 ; and a second bipolar transistor including a second collector layer that has a long-side direction and a short-side direction in a plan view, wherein the long-side direction of the second collector layer is parallel to crystal orientation [011], a cross-section perpendicular to the short-side direction of the second collector layer has an inverted mesa shape, and a cross-section perpendicular to the long-side direction of the second collector layer has a forward mesa shape, a second base layer that is formed on the second collector layer, a second base electrode that is formed on the second base layer, and a second base line that is connected to the second base electrode and that is drawn out from an end in the long-side direction of the second collector layer to the outside of the second collector layer in a plan view.
15 . A semiconductor device comprising:
a third bipolar transistor which is the bipolar transistor according to claim 1 ; and a fourth bipolar transistor which is the bipolar transistor according to claim 1 , wherein the base electrode and the base line are used in common in the third and fourth bipolar transistors.
16 . An RF power amplifier module comprising:
a power amplifier having the bipolar transistor according to claim 1 .Join the waitlist — get patent alerts
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