US2015034928A1PendingUtilityA1

Optical-device surface-sealing composition, optical-device surface-sealing sheet, display, and display manufacturing method

Assignee: MITSUI CHEMICALS INCPriority: Feb 24, 2012Filed: Feb 21, 2013Published: Feb 5, 2015
Est. expiryFeb 24, 2032(~5.6 yrs left)· nominal 20-yr term from priority
H10K 71/40H10K 59/8722H10K 50/8426B32B 15/08H01L 51/5246H01L 51/56C09J 163/00H01L 27/32C08L 2205/03B32B 2457/20B32B 2307/51B32B 2307/412B32B 2274/00B32B 2255/06C08L 63/00C08G 59/56C08G 59/5073C08G 59/245B32B 27/40B32B 27/365B32B 27/325B32B 27/308B32B 27/302B32B 15/20H10K 85/111B32B 27/36B32B 27/32H10K 59/00H10K 71/00
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Claims

Abstract

The purpose of the present invention is to provide the following: an optical-device surface-sealing composition that makes it possible to fabricate an optical-device-using display with a low amount of warpage even if there is a large difference between the coefficients of linear expansion of substrates used in said display; a display with a low amount of warpage; and a manufacturing method therefor. The storage modulus of elasticity (G′(80)) of this optical-device surface-sealing composition, measured at 80° C. after said composition is heated from 40° C. to 80° C. at 5° C./min and then held at 80° C. for 30 minutes, is between 1.0×10 3 and 2.0×10 6 Pa.

Claims

exact text as granted — not AI-modified
1 . An optical device surface-sealing composition comprising a flexible epoxy resin (A) having two or more epoxy groups in a molecule, and a curing accelerator (B),
 the composition having a storage elastic modulus G′ (80) of 1.0×10 3  to 2.0×10 6  Pa at 80° C. measured after temperature increase from 40° C. to 80° C. at 5° C./min and subsequent temperature retention at 80° C. for 30 minutes.   
     
     
         2 . (canceled) 
     
     
         3 . The optical device surface-sealing composition according to  claim 1 , wherein the component (A) is at least one resin selected from the group consisting of an aliphatic epoxy resin, a thiol epoxy resin, a butadiene epoxy resin, a polyol-modified epoxy resin, an ε-caprolactone-modified epoxy resin, a rubber-modified epoxy resin, a dimer acid-modified epoxy resin, a urethane-modified epoxy resin, and an amine-modified epoxy resin. 
     
     
         4 . The optical device surface-sealing composition according to  claim 1 , wherein the component (A) is an epoxy resin having a hard segment including a fluorene structure or a bisphenol structure and a soft segment including a structure derived from a compound selected from the group consisting of C 2-20  alkylene glycol, polybutadiene, and a butadiene-acrylic copolymer or a C 2-20  alkylene group. 
     
     
         5 . The optical device surface-sealing composition according to  claim 1 , wherein 10 to 70 parts by weight of the component (A) is contained in 100 parts by weight of the entire composition. 
     
     
         6 . An optical device surface-sealing composition comprising one or more thermoplastic elastomers selected from the group consisting of a polystyrene-based elastomer, a polyolefin-based elastomer, a polyurethane-based elastomer, and a polyester-based elastomer,
 the composition having a storage elastic modulus G′ (80) of 1.0×10 3  to 2.0×10 6  Pa at 80° C. measured after temperature increase from 40° C. to 80° C. at 5° C./min and subsequent temperature retention at 80° C. for 30 minutes.   
     
     
         7 . The optical device surface-sealing composition according to  claim 1 , wherein the composition is used for surface-sealing an organic EL device. 
     
     
         8 . An optical device surface-sealing sheet comprising a layer formed of a composition according to  claim 1 . 
     
     
         9 . The optical device surface-sealing sheet according to  claim 8 , wherein the composition is used for surface-sealing an organic EL device. 
     
     
         10 . A display comprising, in order:
 a substrate (H);   a surface-sealing material having a storage elastic modulus G′ (80) of 1.0×10 3  to 2.0×10 6  Pa at 80° C.; and   a substrate (L),   wherein an optical device is disposed on the substrate (H) or on the substrate (L), wherein   a linear expansion coefficient of the substrate (L) is smaller than a linear expansion coefficient of the substrate (H), and a difference between the linear expansion coefficient of the substrate (H) and the linear expansion coefficient of the substrate (L) is 5×10 −6  cm/cm/° C. or more.   
     
     
         11 . The display according to  claim 10 , wherein the linear expansion coefficient of the substrate (H) is 20×10 −6  to 200×10 −6  cm/cm/° C. 
     
     
         12 . The display according to  claim 10 , wherein the substrate (H) is a metal plate containing aluminum or a resin plate containing one or more selected from the group consisting of an ester (co)polymer, a cyclic olefin (co)polymer, a 4-methyl-1-pentene (co)polymer, an acrylic (co)polymer, and polycarbonate. 
     
     
         13 . The display according to  claim 10 , wherein the linear expansion coefficient of the substrate (L) is 1×10 −6  to 100×10 −6  cm/cm/° C. 
     
     
         14 . The display according to  claim 10 , wherein the substrate (L) is an inorganic substrate containing glass or silicon, or a resin plate containing one or more selected from the group consisting of an ester (co)polymer, polyimide, polycarbonate, and polyamide. 
     
     
         15 . The display according to  claim 10 , wherein the optical device is an organic EL device. 
     
     
         16 . A method of manufacturing a display comprising:
 obtaining a laminate having, in order, a first substrate on which an optical device is disposed, a layer formed of an optical device surface-sealing composition according to  claim 1  laminated on the optical device, and a second substrate; and   heating the laminate at 50 to 110° C.   
     
     
         17 . The method according to  claim 16 , wherein
 a linear expansion coefficient of the second substrate is smaller than a linear expansion coefficient of the first substrate, and   a difference between the linear expansion coefficient of the one substrate and the linear expansion coefficient of the other substrate is 5×10 −6  cm/cm/° C. or more.   
     
     
         18 . The method according to  claim 16 , wherein the optical device is an organic EL device. 
     
     
         19 . The display according to  claim 10 , wherein the surface-sealing material is a cured product of an optical device surface-sealing composition comprising a flexible epoxy resin (A) having two or more epoxy groups in a molecule, and a curing accelerator (B),
 the composition having a storage elastic modulus G′ (80) of 1.0×10 3  to 2.0×10 8  Pa at 80° C. measured after temperature increase from 40° C. to 80° C. at 5° C./min and subsequent temperature retention at 80° C. for 30 minutes.   
     
     
         20 . The display according to  claim 10 , wherein the surface-sealing material is a thermocompressed material of an optical device surface-sealing composition comprising one or more thermoplastic elastomers selected from the group consisting of a polystyrene-based elastomer, a polyolefin-based elastomer, a polyurethane-based elastomer, and a polyester-based elastomer,
 the composition having a storage elastic modulus G′ (80) of 1.0×10 3  to 2.0×10 6  Pa at 80° C. measured after temperature increase from 40° C. to 80° C. at 5° C./min and subsequent temperature retention at 80° C. for 30 minutes.

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