Processor with a closed vessel that can be pressurized

Abstract

A processor with a closed vessel which can be pressurised and comprises an upper region with a smaller diameter and a lower region with a larger diameter, wherein the upper region comprises a small helix and the lower region comprises a large helix, wherein an admission for materials and one for water are in turn disposed in the upper region and a heavy-part trap is disposed in the lower region.

1 . A processor ( 1 ) with an upper region ( 3 ) with a smaller diameter and a lower region ( 4 ) with a larger diameter, wherein the upper region ( 3 ) comprises a small screw ( 6 ) and the lower region ( 4 ) comprises a large screw ( 7 ), wherein a first admission ( 8 ) for materials ( 9 ) and a second admission ( 10 )  5  for water ( 11 ) are disposed in the upper region ( 3 ), wherein a discharge coil ( 15 ) is disposed above a separating device ( 12 ) and an outlet ( 14 ) for free fibrous material and dissolved matter is disposed beneath the separating device ( 12 ). 
     
     
         2 . The processor according to  claim 1 , wherein a large helix is disposed as a displacer helix ( 13 ) at the lower end of the large screw ( 7 ). 
     
     
         3 . The processor according to  claim 1 , wherein a heavy-part trap ( 17 ) is disposed in the lower region ( 4 ). 
     
     
         4 . The processor according to  claim 1 , wherein the upper region ( 3 ) can be separated from the lower region ( 4 ). 
     
     
         5 . The processor according to  claim 1 , wherein the lower region ( 4 ) comprises an upper part ( 21 ) and a lower part ( 22 ), which are connected detachably to one another in a radially outer region ( 23 ). 
     
     
         6 . The processor according to  claim 1 , wherein a collar ( 25 ) is disposed at the upper end ( 24 ) of the lower region ( 4 ). 
     
     
         7 . The processor according to  claim 1 , wherein a perforated plate is provided as a separating device ( 12 ). 
     
     
         8 . The processor according to  claim 1 , wherein slots are provided as a separating device ( 12 ) which are more than 2 mm long and less than 1.2 mm, preferably less than 0.3 mm wide. 
     
     
         9 . The processor party according to  claim 1 , wherein slots are provided as a separating device ( 12 ) whose longitudinal axis lies on a straight line which runs in a horizontal or vertical sector of +/−45° to a tangent to the rotor motion. 
     
     
         10 . The processor according to  claim 1 , wherein the large helix comprises an upwardly pointing end in the radially outer region. 
     
     
         11 . The processor according to  claim 1 , wherein the large helix comprises at least 3 and preferably 5 helix arms. 
     
     
         12 . The processor according to  claim 1 , wherein the diameter of the lower region is at least twice as large and preferably at least three times as large as the diameter of the upper region. 
     
     
         13 . The processor according to  claim 1 , wherein the admission for materials enables a feed under excess pressure. 
     
     
         14 . The processor according to  claim 1 , wherein the closed vessel comprises loose bodies made of plastic. 
     
     
         15 . A method for operating a processor, in which materials are made free-flowing in a pulper with a first perforated plate, the larger components are separated out, readily defibrable components are carried away through the perforated plate and the larger components are fed to a processor, in which they are separated by a second perforated plate which has a smaller hole diameter than the first perforated plate. 
     
     
         16 . The method according to  claim 15 , in which long materials ( 85 ) and accompanying materials ( 86 ) are separated in a first processor ( 84 ) in the continuous operation and the accompanying materials ( 86 ) are treated charge-wise in a second processor ( 87 ), wherein long materials ( 90 ) are separated out in the second processor ( 87 ) and accompanying materials ( 88 ) are fed from the second processor ( 87 ) via a buffer ( 89 ) back to the second processor ( 87 ), wherein the accompanying materials ( 88 ) are discharged from the circuit after a treatment period. 
     
     
         17 . The method according to  claim 15 , in which the second perforated plate has a smaller hole diameter than the first perforated plate.