US2015033771A1PendingUtilityA1

Modular refrigeration and heat reclamation chiller

Assignee: Emerald Environmental TechnologiesPriority: Aug 2, 2013Filed: Aug 1, 2014Published: Feb 5, 2015
Est. expiryAug 2, 2033(~7 yrs left)· nominal 20-yr term from priority
F25B 29/003F25B 31/006F25B 40/02F25B 25/005Y10T29/49826F25B 2339/047F25B 1/005F25B 2400/071
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Claims

Abstract

The present technology provides a modular refrigeration and heat reclamation chiller system comprising an evaporator configured to vaporize a refrigerant to cool the refrigerant, a compressor coupled to the evaporator and configured to compress the refrigerant, a condenser coupled to the compressor and configured to condense the refrigerant compressed by the compressor, a sub-cooler coupled to the condenser and configured to receive the refrigerant from the condenser so as to selectively extract heat from the refrigerant and to transfer the refrigerant to the evaporator, and an expansion valve coupled to both the sub-cooler and the evaporator.

Claims

exact text as granted — not AI-modified
Having thus described the invention, we claim: 
     
         1 . A modular refrigeration and heat reclamation chiller system comprising:
 an evaporator configured to vaporize a refrigerant to cool the refrigerant;   a compressor coupled to the evaporator and configured to compress the refrigerant;   a condenser coupled to the compressor and configured to condense the refrigerant compressed by the compressor;   a sub-cooler coupled to the condenser and configured to receive the refrigerant from the condenser so as to selectively extract heat from the refrigerant and to transfer the refrigerant to the evaporator; and   an expansion valve coupled to both the sub-cooler and the evaporator.   
     
     
         2 . The system of  claim 1 , wherein the condenser, the evaporator, and the expansion valve each have a refrigerant capacity, the refrigerant capacities of all of the condenser, the evaporator, and the expansion valve are greater than the refrigerant capacity of the compressor. 
     
     
         3 . The system of  claim 2 , wherein the refrigerant capacity of the condenser, evaporator, sub-cooler, and expansion valve produce a compression ratio of less than about 6:1 relative to the compressor. 
     
     
         4 . The system of  claim 2 , wherein the refrigerant capacity of the condenser, evaporator, sub-cooler, and expansion valve produce a compression ratio of less than about 4.5:1 relative to the compressor. 
     
     
         5 . The system of  claim 2 , wherein the refrigerant capacity of the condenser, evaporator, sub-cooler, and expansion valve produce a compression ratio of less than about 4:1 relative to the compressor. 
     
     
         6 . The system of  claim 2 , wherein a heat transfer fluid processed by the system has a temperature drop of less than about 7° F. across the evaporator. 
     
     
         7 . The system of  claim 6 , wherein the refrigerant processed by the system has a temperature drop of less than about 60° F. across the evaporator. 
     
     
         8 . The system of  claim 7 , wherein the refrigerant processed by the system has a pressure drop of less than about 10 psig across the evaporator. 
     
     
         9 . The system of  claim 8 , wherein the heat transfer fluid processed by the system has a temperature of less than about 8° F. at the compressor. 
     
     
         10 . The system of  claim 9 , wherein the temperature of the refrigerant emerging from the evaporator is less than about 80° F. 
     
     
         11 . The system of  claim 10 , wherein the refrigerant processed by the system has a temperature drop of at least than about 30° F. across the condenser. 
     
     
         12 . The system of  claim 11 , wherein a pressure drop of the refrigerant across the condenser is less than about 11 psig. 
     
     
         13 . The system of  claim 12 , wherein the heat transfer fluid processed by the system has a rise in temperature of less than about 10° F. at the condenser. 
     
     
         14 . The system of  claim 13 , wherein the refrigerant processed by the system has a temperature drop of at least than about 40° F. across the sub-cooler. 
     
     
         15 . The system of  claim 14 , wherein a pressure drop of the refrigerant across the sub-cooler is less than about 1.5 psig. 
     
     
         16 . The system of  claim 15 , wherein the heat transfer fluid processed by the system has a drop in temperature of at least about 40° F. across the sub-cooler. 
     
     
         17 . The system of  claim 16  further comprising a cabinet. 
     
     
         18 . A method of using a modular refrigeration and heat reclamation chiller system comprising the step of:
 circulating both a refrigerant and a heat transfer fluid through the system comprising:
 an evaporator configured to vaporize a refrigerant to cool a refrigerant; 
 a compressor coupled to the evaporator and configured to compress the refrigerant; 
 a condenser coupled to the compressor and configured to condense the refrigerant compressed by the compressor to the refrigerant; 
 a sub-cooler coupled to the condenser and configured to receive the refrigerant from the condenser so as to selectively extract heat from the refrigerant and to transfer the refrigerant to the evaporator; and 
 an expansion valve coupled to both the sub-cooler and the evaporator. 
   
     
     
         19 . The method of  claim 18  wherein the system provides a heated heat transfer fluid of about 100° F. and a refrigerated heat transfer fluid of about 10° F. 
     
     
         20 . A method of manufacturing a modular refrigeration and heat reclamation chiller system comprising:
 providing a modular refrigeration and heat reclamation chiller system comprising:
 an evaporator configured to vaporize a refrigerant to cool a refrigerant; 
 a compressor coupled to the evaporator and configured to compress the refrigerant; 
 a condenser coupled to the compressor and configured to condense the refrigerant compressed by the compressor to the refrigerant; 
 a sub-cooler coupled to the condenser and configured to receive the refrigerant from the condenser so as to selectively extract heat from the refrigerant and to transfer the refrigerant to the evaporator; and 
 an expansion valve coupled to both the sub-cooler and the evaporator.

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