Vapor deposition apparatus

Abstract

A vapor deposition apparatus for providing a deposition film on a substrate, the vapor deposition apparatus includes a plurality of first nozzle parts which injects a first raw material toward the substrate; a plurality of second nozzle parts which is alternately disposed together with the plurality of first nozzle parts and injects a second raw material toward the substrate; a diffuser unit which distributes the second raw material to the plurality of second nozzle parts; and a supply unit which supplies the second raw material to the diffuser unit.

What is claimed is: 
     
         1 . A vapor deposition apparatus which provides a deposition film on a substrate, the vapor deposition apparatus comprising:
 a plurality of first nozzle parts which injects a first raw material toward the substrate;   a plurality of second nozzle parts which is alternately disposed with the plurality of first nozzle parts and injects a second raw material toward the substrate;   a diffuser unit which distributes the second raw material to the plurality of second nozzle parts; and   a supply unit which supplies the second raw material to the diffuser unit.   
     
     
         2 . The vapor deposition apparatus of  claim 1 ,
 wherein the diffuser unit comprises an upper plate, a lower plate, and a plurality of distribution plates substantially parallel to one another between the upper plate and the lower plate, and   wherein the plurality of distribution plates is separated from one another.   
     
     
         3 . The vapor deposition apparatus of  claim 2 ,
 wherein holes through which the second raw material passes are defined in each of the plurality of distribution plates, and   wherein a number of first holes defined in a first distribution plate of the plurality of distribution plates disposed nearer to the supply unit than other distribution plates of the plurality of distribution plates is smaller than a number of second holes defined in a second distribution plate of the plurality of distribution plates disposed nearer to the plurality of second nozzle part than other distribution plates of the plurality of distribution plates.   
     
     
         4 . The vapor deposition apparatus of  claim 3 , wherein a size of each of the first holes is larger than a size of each of the second holes. 
     
     
         5 . The vapor deposition apparatus of  claim 3 , wherein an entire area of the second holes is larger than an entire area of the first holes. 
     
     
         6 . The vapor deposition apparatus of  claim 2 , wherein a plurality of slits corresponding to the plurality of second nozzle parts is defined in the lower plate. 
     
     
         7 . The vapor deposition apparatus of  claim 2 , wherein the plurality of distribution plates is detachably coupled to the diffuser unit. 
     
     
         8 . The vapor deposition apparatus of  claim 2 , further comprising a chamber in which the plurality of first nozzle parts, the plurality of second nozzle parts, the diffuser unit, the supply unit and the substrate are disposed, wherein the diffuser unit is in thermal contact with the chamber. 
     
     
         9 . The vapor deposition apparatus of  claim 1 , further comprising an exhaust unit and a purge unit between the plurality of first nozzle part and the plurality of second nozzle part. 
     
     
         10 . The vapor deposition apparatus of  claim 1 , wherein the supply unit comprises a plasma generation part. 
     
     
         11 . The vapor deposition apparatus of  claim 1 , wherein the substrate moves relative to the vapor deposition apparatus. 
     
     
         12 . The vapor deposition apparatus of  claim 1 , further comprising a deposition unit in which the first and second nozzle parts are defined,
 wherein   the first raw material flows in a horizontal direction through the deposition unit to be supplied to the plurality of first nozzle parts, and   the second raw material flows in a perpendicular direction through the deposition unit to be supplied to the plurality of second nozzle parts.   
     
     
         13 . A vapor deposition apparatus which provides a deposition film on a substrate, the vapor deposition apparatus comprising:
 a deposition unit comprising a plurality of first nozzle parts which injects a first raw material toward the substrate and a plurality of second nozzle parts which is alternately disposed with the plurality of first nozzle parts and injects a second raw material toward the substrate;   a diffuser unit which is coupled with the deposition unit and distributes the second raw material to the plurality of second nozzle parts; and   a supply unit which supplies the second raw material to the diffuser unit,   wherein the diffuser unit comprises an upper plate, a lower plate, and a plurality of distribution plates substantially parallel to one another between the upper plate and the lower plate, and   wherein a plurality of slits corresponding to the plurality of second nozzle parts is defined in the lower plate.   
     
     
         14 . The vapor deposition apparatus of  claim 13 , wherein the plurality of distribution plates is separated from one another, and holes through which the second raw material passes are defined in each of the plurality of distribution plates 
     
     
         15 . The vapor deposition apparatus of  claim 14 , wherein a number of first holes defined in a first distribution plate of the plurality of distribution plates disposed nearer to the supply unit than other distribution plates of the plurality of distribution plates is smaller than a number of second holes defined in a second distribution plate of the plurality of distribution plates disposed nearer to the plurality of second nozzle parts than other distribution plates of the plurality of distribution plates. 
     
     
         16 . The vapor deposition apparatus of  claim 15 , wherein
 a size of each of the first holes is larger than a size of each of the second holes, and   an entire area of the second holes is larger than an entire area of the first holes.   
     
     
         17 . The vapor deposition apparatus of  claim 13 , wherein the supply unit comprises a plasma generation part. 
     
     
         18 . The vapor deposition apparatus of  claim 13 , wherein the plurality of distribution plates is detachably coupled to the diffuser unit. 
     
     
         19 . The vapor deposition apparatus of  claim 13 , wherein the deposition unit further comprises an exhaust unit and a purge unit disposed between the plurality of first nozzle parts and the plurality of second nozzle parts. 
     
     
         20 . The vapor deposition apparatus of  claim 13 , wherein
 the first raw material flows in a horizontal direction through the deposition unit to be supplied to the plurality of first nozzle parts, and   the second raw material flows in a perpendicular direction through the deposition unit to be supplied to the plurality of second nozzle parts.