Semiconductor sensor device with footed lid

Abstract

A semiconductor sensor device is packaged using a footed lid instead of a pre-molded lead frame. A semiconductor sensor die is attached to a first side of a lead frame. The die is then electrically connected to leads of the lead frame. A gel material is dispensed onto the sensor die. The footed lid is attached to the substrate such that the footed lid covers the sensor die and the electrical connections between the die and the lead frame. A molding compound is then formed over the substrate and the footed lid such that the molding compound covers the substrate, the sensor die and the footed lid.

1 - 8 . (canceled) 
     
     
         9 . A method of packaging a semiconductor sensor die, comprising the steps of:
 providing a substrate having a first side including a die attach area and substrate electrical connection pads;   attaching a semiconductor sensor die to the die attach area on the first side of the substrate;   electrically connecting bond pads of the sensor die to the substrate electrical connection pads;   dispensing a gel material on a first side of the sensor die such that the gel material covers a membrane of the sensor die;   attaching a footed lid to the first side of the substrate such that the footed lid surrounds the sensor die and the electrical connections between the sensor die and the substrate, and wherein the lid and the substrate form a cavity within which the sensor die is located; and   forming a molding compound over the lid and the first side of the substrate, wherein the molding compound fills the cavity and covers the lid.   
     
     
         10 . The method of packaging a semiconductor sensor die of  claim 9 , wherein the substrate comprises a flexible printed wiring board. 
     
     
         11 . The method of packaging a semiconductor sensor die of  claim 9 , wherein the substrate comprises a lead frame, the die attach area comprises a die pad, and the substrate electrical connection pads comprise lead fingers. 
     
     
         12 . The method of packaging a semiconductor sensor die of  claim 11 , wherein attaching the lid comprises attaching side walls of the lid to respective lead fingers of the lead frame with a lid attach adhesive and curing the lid attach adhesive. 
     
     
         13 . The method of packaging a semiconductor sensor die of  claim 11 , further comprising attaching a tape to a second side of the lead frame before attaching the sensor die to the die pad and removing the tape after forming the molding compound over the lid. 
     
     
         14 . The method of packaging a semiconductor sensor die of  claim 13 , further comprising curing the molding compound prior to removing the tape. 
     
     
         15 . The method of packaging a semiconductor sensor die of  claim 11 , wherein the molding compound fills spaces between the lead fingers and the die pad. 
     
     
         16 . The method of packaging a semiconductor sensor die of  claim 9 , wherein the electrically connecting step comprises connecting the bond pads of the sensor die to the substrate electrical connection pads with wires using a wire bonding process. 
     
     
         17 . The method of packaging a semiconductor sensor die of  claim 9 , wherein the footed lid includes a vent hole that is aligned over the membrane of the sensor die. 
     
     
         18 . The method of packaging a semiconductor sensor die of  claim 17 , wherein the gel material is dispensed onto the sensor die after attaching the footed lid by way of the vent hole. 
     
     
         19 . A method of packaging a semiconductor sensor die, comprising the steps of:
 providing a substrate having a first side including a die attach area and substrate electrical connection pads;   attaching a first type of sensor die to the die attach area with a die attach adhesive, wherein the first type of sensor die comprises one of a piezo resistive transducer and a pressure sensor;   attaching a second type of sensor die to the die attach area with the die attach adhesive;   attaching an integrated circuit die to the die attach area with the die attach adhesive and curing the die attach adhesive;   electrically connecting the first and second types of sensor dies to the integrated circuit die with bond wires and electrically connecting the integrated circuit die with the substrate electrical connection pads with additional bond wires;   attaching side walls of a footed lid to the first side of the substrate with a lid attach adhesive such that the footed lid surrounds the two sensor dies, the integrated circuit die, and the electrical connections between the integrated circuit die and the substrate, wherein a cavity is formed between the footed lid and the first surface of the substrate;   dispensing a gel material onto a top surface of the first type of sensor die; and   forming a molding compound over the footed lid and the first side of the substrate, wherein the molding compound substantially fills the cavity.   
     
     
         20 . The method of packaging a semiconductor sensor die of  claim 19 , wherein the footed lid has a vent hole located in a top surface thereof that is aligned over the first type of sensor die, wherein the gel material is dispensed onto the top surface of the first type of sensor die after attaching the footed lid to the substrate, and wherein the gel material is dispensed onto the first type of sensor die by way of the vent hole.