Electroless copper plating solution

Abstract

Provided is an electroless copper plating solution that forms a highly adhesive conductive film regardless of the degree of roughness of the resin surface and also has a fast deposition rate. The electroless copper plating solution of the present invention is characterized in that it contains guanosine. The electroless copper plating solution of the present invention preferably also contains copper ion, reducing agent, copper ion complexing agent, and pH adjuster.

What is claimed is: 
     
         1 . An electroless copper plating solution containing guanosine. 
     
     
         2 . An electroless copper plating solution according to  claim 1  also containing copper ion, reducing agent, copper ion complexing agent, and pH adjuster. 
     
     
         3 . An electroless copper plating solution according to  claim 1  wherein the content of guanosine is 5-30 mg/L relative to the plating solution. 
     
     
         4 . An electroless copper plating solution according to  claim 2  containing tartaric acid or a salt thereof as a complexing agent. 
     
     
         5 . A method for forming a copper film on the surface of an article being plated using an electroless copper plating solution of any of  claims 1 - 4 .