Semiconductor device manufacturing method and semiconductor device manufacturing apparatus

Abstract

A method of manufacturing a semiconductor device includes: preparing a wafer member, the wafer member including a wafer, a conductive layer formed on a surface of the wafer and a negative photoresist formed on the conductive layer; applying a light blocking material so as to cover at least a part of an outer edge of the wafer member from an upper surface of the negative photoresist to a side surface of the negative photoresist; exposing the negative photoresist to exposure light; removing the light blocking material; and developing the negative photoresist.

What is claimed is: 
     
         1 . A semiconductor device manufacturing apparatus forming a light blocking mask for forming a plating electrode on a wafer, a conductive layer and a negative photoresist being laminated on a principle surface of the wafer, the plating electrode being to be formed from a part of the conductive layer, the apparatus comprising:
 a mount plate on which the wafer is to be mounted, a diameter of the mount plate being less than a diameter of the wafer; and   a light-blocking material supplying mechanism for applying a light blocking material to a first part of an upper surface and a second part of a side surface of the negative photoresist disposed on an outer edge of the wafer mounted on the mount plate so that the light blocking material covers the first part and the second part, thereby forming the light blocking mask on an area on which the plating electrode is to be formed.   
     
     
         2 . The semiconductor device manufacturing apparatus according to  claim 1 , wherein the light-blocking material supplying mechanism includes a supply vent through which the light blocking material is supplied, the supply vent being positioned above an imaginary plane including a mounting surface of the mount plate, the supply vent being capable of moving to a position corresponding to the area on which the plating electrode is to be formed. 
     
     
         3 . The semiconductor device manufacturing apparatus according to  claim 1 , further comprising an air blowing mechanism for supplying air flowing in a direction from a side of a center of the mount plate toward a circumference of the mount plate. 
     
     
         4 . The semiconductor device manufacturing apparatus according to  claim 1 , further comprising an air sucking mechanism including an air suck vent facing an edge part of the mount plate so that the air suck vent includes a part positioned on an imaginary plane including a mounting surface of the mount plate, the air sucking mechanism capable of sucking outside air through the air suck vent, the air suck vent being capable of facing a position corresponding to the area on which the plating electrode is to be formed.