CMP Pad Dressers with Hybridized Abrasive Surface and Related Methods

Abstract

The present invention provides CMP pad dressers and methods for dressing or conditioning CMP pads. In one aspect, a method for conditioning a CMP pad can include cutting the CMP pad with superabrasive cutting elements and controlling a degree of contact between the CMP pad and the cutting elements using control elements. The degree of contact is established through placement of the control elements relative to the cutting elements.

What is claimed is: 
     
         1 . A method for conditioning a CMP pad, comprising:
 cutting the CMP pad with superabrasive cutting elements; and   controlling a degree of contact between the CMP pad and the cutting elements using control elements, wherein the degree of contact is established through placement of the control elements relative to the cutting elements.   
     
     
         2 . The method of  claim 1 , wherein controlling the degree of contact includes alternating regions of cutting elements with regions of control elements. 
     
     
         3 . The method of  claim 2 , wherein controlling the degree of contact includes locating the regions of control elements at a distance from the regions of cutting elements to establish the degree of contact in relation to material characteristics of the CMP pad. 
     
     
         4 . The method of  claim 2 , wherein controlling the degree of contact includes locating the regions of control elements at a distance from the regions of cutting elements to affect a degree of compression of the CMP pad along a leading edge of the regions of cutting elements.