US2015016087A1PendingUtilityA1

Circuit Board, Method For Manufacturing The Circuit Board, And Illumination Device Comprising The Circuit Board

Assignee: OSRAM GMBHPriority: Feb 8, 2012Filed: Feb 7, 2013Published: Jan 15, 2015
Est. expiryFeb 8, 2032(~5.5 yrs left)· nominal 20-yr term from priority
H10W 72/536H10H 20/857H10H 20/036H10H 20/856F21K 9/90F21K 9/30F21K 9/50F21K 9/56H05K 2201/0195H05K 2201/2054F21K 9/60H05K 2201/10106F21K 9/64H05K 1/0274F21K 9/68Y10T29/49156
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Claims

Abstract

A circuit board ( 1 ) for mounting at least one light source ( 10 ), comprising a substrate ( 2 ) and a plurality of printed electrical conductors ( 3 ) printed on the substrate ( 2 ), At least one printed electrical conductor ( 3 ) comprises a first region ( 4 ) for arranging the light sources ( 10 ). The circuit board ( 1 ) further comprises reflectors ( 5 ) which are disposed between the printed electrical conductors ( 3 ) adjacent to each other and cover other regions of the printed electrical conductors ( 3 ) than the first region ( 4 ), wherein the reflectors ( 5 ) are insulating reflectors. The circuit board is easy to manufacture, has relatively high reflective property, and can efficiently reflect the light emitted from the light source. Also disclosed are a method for manufacturing the circuit board, and an illumination device comprising the circuit board.

Claims

exact text as granted — not AI-modified
1 . A circuit board for mounting at least one light source, comprising a substrate and a plurality of printed electrical conductors printed on the substrate, wherein, at least one printed electrical conductor comprises a first region for arranging the light source, the circuit board further comprises reflectors which are disposed between the printed electrical conductors adjacent to each other and cover other regions of the printed electrical conductors than the first region, wherein the reflectors are insulating reflectors. 
     
     
         2 . The circuit board according to  claim 1 , wherein the reflectors are distributed Bragg reflectors. 
     
     
         3 . The circuit board according to  claim 2 , wherein the reflectors cover, through electron beam evaporation process or magnetron sputtering process, regions between the printed electrical conductors adjacent to each other, and the other regions than the first region. 
     
     
         4 . The circuit board according to  claim 1 , wherein the reflector comprises a first layer made from SiO2 and a second layer made from TiO2. 
     
     
         5 . The circuit board according to  claim 4 , wherein a thickness D of the first layer or the second layer is calculated according to a formula D=λ/4n, where λ is a central wavelength of light emitted by the light source, and n is a refractive index of the first layer or the second layer. 
     
     
         6 . The circuit board according to  claim 4 , wherein the reflector is a composite layered structure formed by alternatively disposing the first layer and the second layer. 
     
     
         7 . The circuit board according to  claim 6 , wherein the first layer and the second layer are alternatively disposed 3-7 times to form the reflector, wherein the reflector comprises 3-7 first layers and 3-7 second layers. 
     
     
         8 . The circuit board according to  claim 1 , wherein the first region is arranged in a central region of respective printed electrical conductor. 
     
     
         9 . A method for manufacturing a circuit board for mounting at least one light source according to  claim 1 , comprising the steps of:
 a) providing a substrate printed with a plurality of printed electrical conductors;   b) covering the printed electrical conductors and regions between the printed electrical conductors adjacent to each other with insulating reflectors; and   c) removing part of the reflectors which are on the printed electrical conductors to form a first region for mounting the light source.   
     
     
         10 . An illumination device, comprising at least one LED chip, further comprising a circuit board according to  claim 1 , wherein the LED chip, as the light source, is mounted on the first region of the circuit board. 
     
     
         11 . The illumination device according to  claim 10 , wherein the LED chip and the circuit board are integrally packaged through a COB process. 
     
     
         12 . The illumination device according to  claim 10 , wherein the light source is a blue LED chip, and the illumination device further comprises a remote phosphor cover stimulated to produce yellow light.

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