Method for manufacturing display device

Abstract

A method for manufacturing a display device may include forming a plurality of plastic films on a carrier substrate using a mask member. The plastic films may be spaced from each other and may include a first plastic film. The method may further include forming a display unit that includes a plurality of pixels on each of the plastic films, wherein a first display unit may be formed on the first plastic film. The method may further include separating the carrier substrate from the plastic films to obtain a plurality of display devices that includes the display device. The display device may include the first plastic film and the first display unit.

What is claimed is: 
     
         1 . A method for manufacturing a display device, the method comprising:
 forming a plurality of plastic films on a carrier substrate using a mask member, the plastic films being spaced from each other and including a first plastic film;   forming a display unit that includes a plurality of pixels on each of the plastic films, a first display unit being formed on the first plastic film; and   separating the carrier substrate or portions of the carrier substrate from the plastic films to obtain a plurality of display devices that includes the display device, the display device including the first plastic film and the first display unit.   
     
     
         2 . The method of  claim 1 , further comprising: cutting the carrier substrate at locations between the plastic films before the separating such that the portions of the carrier substrate are separated from each other. 
     
     
         3 . The method of  claim 2 , wherein the cutting is performed using a cutting member, and wherein a distance between two immediately neighboring plastic films of the plastic films in a direction is larger than a width of the cutting member in the direction. 
     
     
         4 . The method of  claim 3 , wherein the cutting member contacts the carrier substrate without directly contacting any of the plastic films. 
     
     
         5 . The method of  claim 2 , wherein the cutting is performed at least along a cutting line that is equally distant from two immediately neighboring plastic films of the plastic films. 
     
     
         6 . The method of  claim 1 , further comprising: removing the mask member from the plastic films before forming the first display unit on the first plastic film. 
     
     
         7 . The method  claim 1 , further comprising: attaching the mask member to the carrier substrate such that the mask member contacts the carrier substrate before the forming of the plastic films, wherein the mask member has a plurality of openings that exposes portions of a surface of the carrier substrate. 
     
     
         8 . The method of  claim 7 , wherein the forming of the plurality of plastic films includes disposing a polymer material in the plurality of openings using one of spin coating, nozzle printing, and inkjet printing. 
     
     
         9 . The method of  claim 8 , further comprising: after the disposing of the polymer material, removing a solvent from the polymer material by performing a soft bake process. 
     
     
         10 . The method of  claim 8 , further comprising:
 after the disposing of the polymer material, removing a solvent from the polymer material; and   after the solvent has been substantially removed from the polymer material, remove the mask member from the carrier substrate.   
     
     
         11 . The method  claim 8 , further comprising:
 curing the polymer material; and   after the curing, removing the mask member from the carrier substrate.   
     
     
         12 . The method of  claim 1 , wherein the first plastic film comprises at least one of polyimide and polycarbonate. 
     
     
         13 . The method of  claim 1 , wherein each of the pixels comprises a thin film transistor, a capacitor, a pixel electrode, an organic emission layer, and a portion of a common electrode. 
     
     
         14 . The method of  claim 1 , further comprising: after the first display unit has been formed on the first plastic film, encapsulating the first display unit using an encapsulation layer. 
     
     
         15 . The method of  claim 14 , wherein a width of the encapsulation layer in a direction is greater than or equal to a width of the first display unit in the direction and is less than or equal to a width of the first plastic film in the direction. 
     
     
         16 . The method of  claim 14 , wherein the encapsulation layer includes an organic layer and an inorganic layer that overlap each other. 
     
     
         17 . The method of  claim 14 , wherein the encapsulation layer does not directly contact the carrier substrate. 
     
     
         18 . The method  claim 1 , further comprising: irradiating a laser beam to interfaces between the carrier substrate or the portions of the carrier substrate and the plastic films for performing the separating.