Enclosure of high heat dispersion capacity and electronic device using same

Abstract

An enclosure includes a casing, a heat dispersion layer, and a cover glass. The casing includes an outer surface. The heat dispersion layer is covered on the outer surface. The cover glass is covered on a side of the heat dispersion layer facing away from the casing, and a part of the heat dispersion layer is exposed to air from the cover glass. The heat dispersion layer has a larger heat dispersion area than the casing.

What is claimed is: 
     
         1 . An enclosure, comprising:
 a casing comprising an outer surface;   a heat dispersion layer covered on the outer surface; and   a cover glass covered on a side of the heat dispersion layer facing away the casing, a part of the heat dispersion layer exposing from the cover glass, the heat dispersion layer having a larger heat dispersion area than the casing.   
     
     
         2 . The enclosure of  claim 1 , wherein a thermal conductivity of the heat dispersion layer is greater than the casing. 
     
     
         3 . The enclosure of  claim 1 , wherein the heat dispersion layer is made of graphene or carbon nanotubes. 
     
     
         4 . The enclosure of  claim 1 , further comprising two optical glue layers, wherein one optical glue layer is adhered between the heat dispersion layer and the casing, another optical glue layer is adhered between the cover glass and the heat dispersion layer. 
     
     
         5 . The enclosure of  claim 1 , wherein sides of the heat dispersion layer are directly exposed to air. 
     
     
         6 . An electronic device, comprising;
 an enclosure, comprising:   a casing comprising an outer surface;   a heat dispersion layer covered on the outer surface; and   a cover glass covered on a side of the heat dispersion layer facing away the casing, a part of the heat dispersion layer exposing from the cover glass, the heat dispersion layer having a larger heat dispersion area than the casing; and   at lease one electronic device received in the enclosure.   
     
     
         7 . The electronic device of  claim 6 , wherein a thermal conductivity of the heat dispersion layer is greater than the casing. 
     
     
         8 . The electronic device of  claim 6 , wherein the heat dispersion layer is made of graphene or carbon nanotube. 
     
     
         9 . The electronic device of  claim 6 , further comprising two optical glue layers, wherein one optical glue layer is adhered between the heat dispersion layer and the casing, another optical glue layer is adhered between the cover glass and the heat dispersion layer. 
     
     
         10 . The electronic device of  claim 6 , wherein sides of the heat dispersion layer are directly exposed to air.