Electronic component and manufacturing method

Abstract

An electronic component includes a first article and a second article. The second article comprises a plurality of surface slots. The slots are filled with adhesives. The first article is attached to the second article by the adhesives, regions of the first article and the second article are in direct contact except for regions covered with adhesives.

What is claimed is: 
     
         1 . An electronic component, comprising:
 a first article; and   a second article comprising a plurality of slots defined in a first side thereof, the slots filled with adhesives, the first article attached to the first side of the second article by the adhesives, first regions of the first article and the first side of the second article being in contact directly except for second regions of the first article adhered with adhesives.   
     
     
         2 . The electronic component of  claim 1 , wherein each slot comprises an elongated main portion and a plurality of branch portions alternatively extending from two opposite side edges of the main portion. 
     
     
         3 . The electronic component of  claim 1 , wherein the adhesives are nano-adhesives. 
     
     
         4 . The electronic component of  claim 1 , wherein the first article and the second article are metal foils and the adhesives are conductive. 
     
     
         5 . The electronic component of  claim 1 , wherein a depth of the slot is 200 μm. 
     
     
         6 . A method for manufacturing an electronic component, comprising:
 providing a first article and a second article;   defining a plurality of slots in a first side of the second article;   filled adhesives in the slots; and   attaching the first article to the first side of the second article by the adhesives, first regions of the first article and the second article being in contact directly except for second regions of the first article adhered with the adhesives.   
     
     
         7 . The method of  claim 6 , wherein the slots are defined by chemical or thermal energy. 
     
     
         8 . The method of  claim 6 , wherein each slot comprises an elongated main portion and a plurality of branch portions alternatively extending from two opposite side edges of the main portion. 
     
     
         9 . The method of  claim 6 , wherein a depth of the slot is 200 μm. 
     
     
         10 . The method of  claim 6 , wherein the adhesives are nano-adhesives.