Composition for forming passivation film, including resin having carbon-carbon multiple bond

Abstract

There is provided a composition for forming a passivation film that satisfies electric insulation, heat-tolerance, solvent-tolerance, and a dry etch back property at the same time. A composition for forming a passivation film, including: a polymer containing a unit structure of Formula (i): T 0 -O  Formula (i) (where T 0 is a sulfonyl group, a fluoroalkylene group, a cycloalkylene group, or an arylene group having a substituent, or is a combination of an arylene group optionally having a substituent and a fluoroalkylene group or a cycloalkylene group), wherein the polymer has at least one of a group having a structure of Formula (2-A), a group having a structure of Formula (2-B), or a group having both of the structures, at an end, in a side chain, or in a main chain of the polymer: The polymer may contain a unit structure of Formula (1): L 1 -O-T 1 -O  Formula (1)

1 . A composition for forming a passivation film, comprising:
 a polymer containing a unit structure of Formula (i):
   T 0 -O  Formula (i)
 
   
       (where T 0  is a sulfonyl group, a fluoroalkylene group, a cycloalkylene group, or an arylene group having a substituent, or is a combination of an arylene group optionally having a substituent and a fluoroalkylene group or a cycloalkylene group), wherein
 the polymer has at least one of a group having a structure of Formula (2-A), a group having a structure of Formula (2-B), or a group having both of the structures, at an end, in a side chain, or in a main chain of the polymer: 
 
       
         
           
           
               
               
           
         
       
     
     
         2 . A composition for forming a passivation film, comprising:
 a polymer containing a unit structure of Formula (1):
   L 1 -O-T 1 -O  Formula (1)
 
   
       (where L 1  is an arylene group optionally having a substituent, or is a combination of an arylene group optionally having a substituent and a sulfonyl group, a carbonyl group, an ester group, an amido group, a sulfinyl group, or a sulfonamide group; and T 1  is a fluoroalkylene group, a cycloalkylene group, or an arylene group having a substituent, or is a combination of an arylene group optionally having a substituent and a fluoroalkylene group or a cycloalkylene group, or is a combination of an arylene group optionally having a substituent, a fluoroalkylene group, and a cycloalkylene group), wherein
 the polymer has at least one of a group having a structure of Formula (2-A), a group having a structure of Formula (2-B), or a group having both of the structures, at an end, in a side chain, or in a main chain of the polymer: 
 
       
         
           
           
               
               
           
         
       
     
     
         3 . The composition for forming a passivation film according to  claim 1 , wherein
 the arylene group is a phenylene group, a naphthylene group, or an anthrylene group.   
     
     
         4 . The composition for forming a passivation film according to  claim 1 , wherein
 the polymer is a homopolymer having one type of unit structure.   
     
     
         5 . The composition for forming a passivation film according to  claim 1 , wherein
 the polymer is a copolymer having at least two types of unit structures.   
     
     
         6 . The composition for forming a passivation film according to  claim 2 , comprising:
 a polymer containing a unit structure of Formula (1) where L 1  is a group of Formula (3) below, a unit structure of Formula (1) where L 1  is a group of Formula (4) below, or a combination of these unit structures:   
       
         
           
           
               
               
           
         
       
       (where each of R 1 , R 2 , and R 3  is a C 1-10  alkyl group, a C 1-4  fluoroalkyl group, a hydroxy group, an allyl group, an allyloxy group, an amino group, a cyano group, a nitro group, an acyl group, an acyloxy group, a carboxy group, a group having a tertiary carbon atom, a cycloalkyl group, or a combination of any of these groups; L 2  is a sulfonyl group, a carbonyl group, an ester group, an amido group, a sulfinyl group, or a sulfonamide group; and each of n1, n2, and n3 is an integer of 0 to 4). 
     
     
         7 . The composition for forming a passivation film according to  claim 2 , comprising:
 a polymer containing a unit structure of Formula (1) where T 1  is a group of Formula (5) below, a unit structure of Formula (1) where T 1  is a group of Formula (6) below, or a combination of these unit structures:   
       
         
           
           
               
               
           
         
       
       (where each of R 4 , R 5 , and R 6  is a C 1-10  alkyl group, a C 1-4  fluoroalkyl group, a hydroxy group, an allyl group, an allyloxy group, an amino group, a cyano group, a nitro group, an acyl group, an acyloxy group, a carboxy group, a group having a tertiary carbon atom, a cycloalkyl group, or a combination of any of these groups; T 2  is a fluoroalkylene group, a cycloalkylene group, or a combination of these groups; and each of n4, n5, and n6 is an integer of 0 to 4). 
     
     
         8 . The composition for forming a passivation film according to  claim 6 , wherein
 in Formula (3), R 1  is a group containing at least a cyano group, and n1 is an integer of 1 to 4.   
     
     
         9 . The composition for forming a passivation film according to  claim 6 , wherein
 in Formula (4), L 2  is a sulfonyl group or a carbonyl group.   
     
     
         10 . The composition for forming a passivation film according to  claim 1 , further comprising:
 a polymer containing a unit structure of Formula (7):
   L 3 -O-T 3 -O  Formula (7)
 
   
       (where L 3  is Formula (3) or Formula (4): 
       
         
           
           
               
               
           
         
       
       (where each of R 1 , R 2 , and R 3  is a C 1-10  alkyl group, a C 1-4  fluoroalkyl group, a hydroxy group, an allyl group, an allyloxy group, an amino group, a cyano group, a nitro group, an acyl group, an acyloxy group, a carboxy group, a group having a tertiary carbon atom, a cycloalkyl group, or a combination of any of these groups; L 2  is a sulfonyl group, a carbonyl group, an ester group, an amido group, a sulfinyl group, or a sulfonamide group; and each of n1, n2, and n3 is an integer of 0 to 4), T 3  is an alkylene group, a sulfonyl group, a carbonyl group, a C 6-30  arylene group optionally having a substituent, or a combination of any of these groups). 
     
     
         11 . The composition for forming a passivation film according to  claim 1 , wherein
 the arylene group is a phenylene group, a naphthylene group, or an anthrylene group.   
     
     
         12 . The composition for forming a passivation film according to  claim 10 , wherein
 T 3  is a group of Formula (8):   
       
         
           
           
               
               
           
         
       
       (where each of R 7  and R 8  is a C 1-10  alkyl group, a C 1-4  fluoroalkyl group, a hydroxy group, an allyl group, an allyloxy group, an amino group, a cyano group, a nitro group, an acyl group, an acyloxy group, a carboxy group, a group having a tertiary carbon atom, a cycloalkyl group, or a combination of any of these groups; each of n7 and n8 is an integer of 0 to 4; and T 4  is an alkylene group, a sulfonyl group, a carbonyl group, a C 6-30  arylene group optionally having a substituent, or a combination of any of these groups). 
     
     
         13 . The composition for forming a passivation film according to  claim 6 , wherein
 the group having a tertiary carbon atom is a tertiary butyl group.   
     
     
         14 . The composition for forming a passivation film according to  claim 1 , wherein
 weight-average molecular weight of the polymer is from 500 to 5,000,000.   
     
     
         15 . The composition for forming a passivation film according to  claim 1 , further comprising:
 a solvent.   
     
     
         16 . A passivation film obtained by applying the composition for forming a passivation film as claimed in  claim 1  to a substrate, and baking the substrate. 
     
     
         17 . The passivation film according to  claim 16 , wherein
 the passivation film is used as a film protecting an IC circuit formed on a wafer.   
     
     
         18 . The passivation film according to  claim 16 , wherein
 the passivation film is used as a film protecting an electrode formed on a rear surface of a wafer.