Low surface roughness polishing pad

Abstract

The invention provides a polishing pad comprising a polishing pad body comprising a polishing surface, wherein the polishing body comprises pores, and wherein the polishing surface has a surface roughness of about 0.1 μm to about 10 μm.

1 . A polishing pad comprising a polishing pad body comprising a polishing surface, wherein the polishing body comprises pores, and wherein the polishing surface has a surface roughness of about 0.1 μm to about 4 μm. 
     
     
         2 . The polishing pad of  claim 1 , wherein the polishing surface has a surface roughness of about 0.5 μm to about 2 μm. 
     
     
         3 . The polishing pad of  claim 1 , wherein the pores have an average pore diameter of about 2 μm to about 150 μm. 
     
     
         4 . The polishing pad of  claim 1 , wherein the polishing pad has a storage modulus of elasticity at 30° C. of about 5 MPa to about 600 MPa. 
     
     
         5 . The polishing pad of  claim 1 , wherein the polishing pad body comprises thermoplastic polyurethane. 
     
     
         6 . The polishing pad of  claim 1 , wherein the polishing pad further comprises a pad substrate. 
     
     
         7 . The polishing pad of  claim 6 , wherein the polishing pad body has a non-polishing surface that is opposite to the polishing surface, and wherein the pad substrate is bonded to the non-polishing surface. 
     
     
         8 . The polishing pad of  claim 1 , wherein the polishing pad further comprises an optically transmissive region extending from the polishing surface to a surface opposite to the polishing surface. 
     
     
         9 . A method of polishing a substrate, which method comprises:
 (i) providing a substrate to be polished,   (ii) contacting the substrate with a polishing pad of  claim 1  and a polishing composition, and   (iii) moving the substrate relative to the polishing pad with the polishing composition therebetween to abrade at least a portion of the substrate to polish the substrate.