Heat-dissipation sheet assembly manufactured by using electrochemical method
Abstract
There is provided a heat-dissipation sheet assembly comprising a heat-dissipation sheet layer having good heat conductivity and a protection layer(s) electrodeposited on one or both sides of the heat-dissipation sheet layer. When the heat-dissipation sheet layer is immersed in an aqueous solution for electrodeposition added with a material for electrodeposition and electric current is permitted to flow in the aqueous solution, the protection layer(s) is electrodeposited on the one or both sides of the heat-dissipation sheet layer. The heat-dissipation sheet assembly can be attached to a heat-generating unit by applying an adhesion layer to an underside of the heat-dissipation sheet assembly.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A heat-dissipation sheet assembly comprising:
a heat-dissipation sheet layer having good heat conductivity; and a protection layer(s) electrodeposited on one or both sides of the heat-dissipation sheet layer by immersing the heat-dissipation sheet layer into an aqueous solution for electrodeposition with an added material for electrodeposition and permitting electric current to flow in the aqueous solution, and the heat-dissipation sheet assembly may be attached to a heat-generating unit by applying an adhesion layer to an underside of the heat-dissipation sheet assembly.
2 . The heat-dissipation sheet assembly according to claim 1 , wherein the heat-dissipation sheet layer is preprocessed by immersing into an aqueous solution containing a copper component before immersing into the aqueous solution for electrodeposition, for better electrodeposition.
3 . The heat-dissipation sheet assembly according to claim 1 , wherein the heat-dissipation sheet layer is a thin film made of a natural graphite, artificial graphite, copper, silver, aluminum or gold sheet.
4 . The heat-dissipation sheet assembly according to claim 1 , wherein the material for electrodeposition is gold, silver, copper, aluminium or nickel.
5 . The heat-dissipation sheet assembly according to claim 1 , wherein the aqueous solution for electrodeposition is a solution with added sodium cyanide or organic acid silver, or a solution with added nickel sulfamate, nickel chloride and boric acid.
6 . The heat-dissipation sheet assembly according to claim 1 , wherein the thickness of the heat-dissipation sheet layer is 10˜40 μm and the thickness of the protection layer is 0.1˜3 μm.
7 . The heat-dissipation sheet assembly according to claim 1 further comprising:
an adhesion layer to attach the heat-dissipation sheet assembly to the heat-generating unit; and
a release paper on an underside of the adhesion layer, the release paper being easily detached from the adhesion layer.Join the waitlist — get patent alerts
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