US2014370222A1PendingUtilityA1

Heat-dissipation sheet assembly manufactured by using electrochemical method

Assignee: A TECH SOLUTION CO LTDPriority: Jun 18, 2013Filed: Jul 28, 2013Published: Dec 18, 2014
Est. expiryJun 18, 2033(~6.9 yrs left)· nominal 20-yr term from priority
H10W 40/258H10W 40/255H10W 40/25Y10T428/1438Y10T428/1443Y10T428/12882F28F 21/081Y10T428/1275F28F 3/00F28F 21/089F28F 21/02
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Claims

Abstract

There is provided a heat-dissipation sheet assembly comprising a heat-dissipation sheet layer having good heat conductivity and a protection layer(s) electrodeposited on one or both sides of the heat-dissipation sheet layer. When the heat-dissipation sheet layer is immersed in an aqueous solution for electrodeposition added with a material for electrodeposition and electric current is permitted to flow in the aqueous solution, the protection layer(s) is electrodeposited on the one or both sides of the heat-dissipation sheet layer. The heat-dissipation sheet assembly can be attached to a heat-generating unit by applying an adhesion layer to an underside of the heat-dissipation sheet assembly.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
         1 . A heat-dissipation sheet assembly comprising:
 a heat-dissipation sheet layer having good heat conductivity; and   a protection layer(s) electrodeposited on one or both sides of the heat-dissipation sheet layer by immersing the heat-dissipation sheet layer into an aqueous solution for electrodeposition with an added material for electrodeposition and permitting electric current to flow in the aqueous solution,   and the heat-dissipation sheet assembly may be attached to a heat-generating unit by applying an adhesion layer to an underside of the heat-dissipation sheet assembly.   
     
     
         2 . The heat-dissipation sheet assembly according to  claim 1 , wherein the heat-dissipation sheet layer is preprocessed by immersing into an aqueous solution containing a copper component before immersing into the aqueous solution for electrodeposition, for better electrodeposition. 
     
     
         3 . The heat-dissipation sheet assembly according to  claim 1 , wherein the heat-dissipation sheet layer is a thin film made of a natural graphite, artificial graphite, copper, silver, aluminum or gold sheet. 
     
     
         4 . The heat-dissipation sheet assembly according to  claim 1 , wherein the material for electrodeposition is gold, silver, copper, aluminium or nickel. 
     
     
         5 . The heat-dissipation sheet assembly according to  claim 1 , wherein the aqueous solution for electrodeposition is a solution with added sodium cyanide or organic acid silver, or a solution with added nickel sulfamate, nickel chloride and boric acid. 
     
     
         6 . The heat-dissipation sheet assembly according to  claim 1 , wherein the thickness of the heat-dissipation sheet layer is 10˜40 μm and the thickness of the protection layer is 0.1˜3 μm. 
     
     
         7 . The heat-dissipation sheet assembly according to  claim 1  further comprising:
 an adhesion layer to attach the heat-dissipation sheet assembly to the heat-generating unit; and 
 a release paper on an underside of the adhesion layer, the release paper being easily detached from the adhesion layer.

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