US2014366580A1PendingUtilityA1
Method for cutting tempered glass
Assignee: DONGGUAN MASSTOP LIQUID CRYSTAL DISPLAY CO LTDPriority: Jan 27, 2010Filed: Sep 3, 2014Published: Dec 18, 2014
Est. expiryJan 27, 2030(~3.5 yrs left)· nominal 20-yr term from priority
B24B 7/241C03C 15/00C03B 33/02C03C 21/002C03B 33/023Y10T428/24479C03C 21/00B32B 3/30Y10T428/2457Y02P40/57
50
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Claims
Abstract
A method for cutting a tempered glass including the steps of strengthening a glass substrate to form, from a surface to the inside of the glass substrate, at least one compression stress layer and a tensile stress layer corresponding to the compression stress layer; removing a part of the glass substrate, wherein the compression stress layer is formed in the part of the glass substrate and a predetermined cutting path passes through the part of the glass substrate; and cutting the glass substrate along the predetermined cutting path.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A method for cutting a tempered glass, comprising the steps of:
strengthening a glass substrate to form, from a surface to the inside of the glass substrate, at least one compression stress layer and a tensile stress layer corresponding to the compression stress layer; removing a part of the glass substrate, wherein the compression stress layer is formed in the part of the glass substrate, and a predetermined cutting path passes through the part of the glass substrate; and cutting the glass substrate along the predetermined cutting path.
2 . The method as claimed in claim 1 , wherein the glass substrate is given an ion exchange glass strengthening treatment.
3 . The method as claimed in claim 1 , wherein the part of the glass substrate is removed by etching or polishing.
4 . A method for cutting a tempered glass, comprising the steps of:
strengthening a glass substrate by an ion exchange glass strengthening treatment to form, from a surface to the inside of the glass substrate, at least one compression stress layer and a tensile stress layer corresponding to the compression stress layer; forming at least one trench on the glass substrate without splitting the glass substrate at a position overlapping the compression stress layer and a predetermined cutting path; and cutting the glass substrate along the trench.
5 . A method for cutting a tempered glass, comprising the steps of:
strengthening a glass substrate to form, from a surface to the inside of the glass substrate, at least one compression stress layer and a tensile stress layer corresponding to the compression stress layer; forming at least one trench on the glass substrate and in the compression stress layer without splitting the glass substrate to remove a part of the compression stress layer and correspondingly reduce a tensile stress along the trench; and forming a scribe line in the trench to initiate a cutting treatment and define a cutting path for the cutting treatment.
6 . The method as claimed in claim 5 , wherein the glass substrate is given an ion exchange glass strengthening treatment.
7 . The method as claimed in claim 5 , wherein the trench is formed by etching or polishing.Join the waitlist — get patent alerts
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