US2014364042A1PendingUtilityA1
Cylindrical Surface Profile Cutting Tool and Process
Est. expiryJun 10, 2033(~6.9 yrs left)· nominal 20-yr term from priority
B23C 3/34B23C 2210/088B23D 43/06B23C 2215/242B23C 5/109B23C 2222/04B24B 33/027B23D 37/04C23C 4/02B23C 2222/52B24B 5/08B24B 19/028B23C 5/1081B23C 2226/315B23C 3/02
38
PatentIndex Score
0
Cited by
0
References
0
Claims
Abstract
A method of cutting a profile in a cylinder surface. The method includes simultaneously interpolating an axial portion of the cylindrical surface using a cutting tool to form a profile having a plurality of annular grooves and a pocket having a radius larger than the cylindrical surface prior to the interpolating step.
Claims
exact text as granted — not AI-modifiedWhat is claimed:
1 . A method of cutting a profile in a cylinder surface, the method comprising:
simultaneously interpolating an axial portion of the cylindrical surface using a cutting tool to form a profile having a plurality of annular grooves and a pocket having a radius larger than the cylindrical surface prior to the interpolating step.
2 . The method of claim 1 , wherein flat peaks are formed between adjacent grooves, and further comprising deforming each flat peak to form an undercut region.
3 . The method of claim 1 , further comprising forming the cylindrical surface by pre-boring an unhoned cylindrical surface.
4 . The method of claim 1 , wherein the cylindrical surface is an aluminum or magnesium alloy.
5 . The method of claim 1 , wherein the cutting tool includes a cylindrical cutting body having cutting elements and mounted in a spindle.
6 . The method of claim 5 , wherein the simultaneously interpolating step includes rotating the cylindrical cutting body relative to the spindle at a rotation speed.
7 . The method of claim 6 , wherein the rotation speed is at least 4,500 rpm.
8 . The method of claim 5 , wherein the simultaneously interpolating step includes rotating the spindle about cylindrical surface axis.
9 . The method of claim 8 , wherein the rotation speed is at least 0.15 millimeters per revolution.
10 . The method of claim 2 , wherein the deforming step is carried out using a swiping tool having multiple deforming surfaces.
11 . The method of claim 10 , wherein the deforming step includes rotating the swiping tool at a rotational speed.
12 . The method of claim 10 , wherein the swiping tool deforming edges having nonzero axial helix to reduce tool deflection.
13 . The method of claim 10 , wherein the swiping tool deforming edges are ground with radially staggered axial relief grooves to reduce tool deflection.
14 . The method of claim 5 , wherein the cutting elements include two or more axial rows of cutting elements.
15 . A method of cutting a profile in an inner surface of a cylindrical bore, the inner surface including an axial travel area and an axial non-travel area, the method comprising:
interpolating the axial non-travel area using a cutting tool to form a profile having a plurality of annular grooves.
16 . The cylindrical bore of claim 15 , wherein the nominal diameter of the axial travel area is greater than that of the axial non-travel area.
17 . The cylindrical bore of claim 15 , wherein the axial non-travel area includes two discontinuous axial widths of the cylindrical bore, and the axial travel area extends therebetween.
18 . The cylindrical bore of claim 15 , wherein the aspect ratio of the depth of the annular grooves to the width of the annual grooves is 0.5 or less.
19 . The method of claim 15 , wherein the plurality of annular grooves are a plurality of rectangular annular grooves.
20 . A method of cutting a profile in a cylinder bore surface, the method comprising:
forming a profile having a plurality of annular grooves and a plurality of peaks therebetween; and cutting an upper portion of the plurality of annular peaks to reduce the height of the annular peaks.Join the waitlist — get patent alerts
Track US2014364042A1 — get alerts on status changes and closely related new filings.
We store only your email — no account needed. See our privacy policy.