US2014361379A1PendingUtilityA1

Semiconductor device incorporating a multi-function layer into the gate stacks

Assignee: GLOBALFOUNDRIES INCPriority: Sep 4, 2012Filed: Aug 22, 2014Published: Dec 11, 2014
Est. expirySep 4, 2032(~6.1 yrs left)· nominal 20-yr term from priority
Inventors:Derya Deniz
H10D 64/01342H10D 64/01318H10D 64/013H10D 84/0188H10D 84/0177H10D 84/85H10D 84/038H10D 64/667H10D 64/017H10D 84/856H01L 27/0922H01L 29/4966
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Claims

Abstract

Approaches are provided for forming a semiconductor device (e.g., a FET) having a multi-function layer (e.g., niobium carbide (NbC)) that serves as a work function layer and a gate metal layer in gate stacks of solid state applications. By introducing a single layer with multiple functions, total number of layers that needs processing (e.g., recessing) may be decreased. As such, the complexity of device integration and resulting complications may be reduced.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
         1 . A semiconductor device, comprising:
 a p-FET portion having a first gate stack thereon, the first gate stack comprising a first high-k dielectric layer over the p-FET portion, a first work function (WF) metal layer over the first high-k dielectric layer, and a first niobium carbide (NbC) as a gate metal layer over the first WF layer; and   an n-FET portion having a second gate stack thereon, the second gate stack comprising a second high-k dielectric layer over the n-FET portion, and a second NbC multi-function layer over the second high-k dielectric layer.   
     
     
         2 . The semiconductor device of  claim 1 , the first gate stack further comprising a first glue layer between the first WF metal layer and the first NbC layer, and the second gate stack further comprising a second glue layer between second high-k dielectric layer and the second NbC multi-function layer. 
     
     
         3 . The semiconductor device of  claim 1 , the first gate stack further comprising a first recess formed over the first high-k dielectric layer, the first work function (WF) metal and the first niobium carbide (NbC) layer. 
     
     
         4 . The semiconductor device of  claim 3 , further comprising a first cap layer formed in the first recess. 
     
     
         5 . The semiconductor device of  claim 3 , the second gate stack further comprising a second recess formed over the second high-k dielectric layer and the second niobium carbide (NbC) multi-function layer. 
     
     
         6 . The semiconductor device of  claim 5 , further comprising a second cap layer formed in the second recess.

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