Substrate detergent composition

Abstract

The invention provides a substrate detergent composition used for cleaning a surface of a substrate, comprising: (A) A quaternary ammonium salt: 0.1 to 2.0% by mass; (B) Water: 0.1 to 0.4% by mass; and (C) An organic solvent: 94.0 to 99.8% by mass. There can be provided a substrate detergent composition used for cleaning a surface of a substrate contaminated with a silicone component whose water contact angle is 100° or more.

What is claimed is: 
     
         1 . A substrate detergent composition used for cleaning a surface of a substrate, comprising:
 (A) A quaternary ammonium salt: 0.1 to 2.0% by mass;   (B) Water: 0.1 to 0.4% by mass; and   (C) An organic solvent: 94.0 to 99.8% by mass.   
     
     
         2 . The substrate detergent composition according to  claim 1 , wherein the substrate to be cleaned is a silicon semiconductor substrate whose water contact angle is 100° or more. 
     
     
         3 . The substrate detergent composition according to  claim 1 , wherein the quaternary ammonium salt is tetraalkylammonium hydroxide. 
     
     
         4 . The substrate detergent composition according to  claim 2 , wherein the quaternary ammonium salt is tetraalkylammonium hydroxide. 
     
     
         5 . The substrate detergent composition according to  claim 3 , wherein the tetraalkylammonium hydroxide is tetraethylammonium hydroxide. 
     
     
         6 . The substrate detergent composition according to  claim 4 , wherein the tetraalkylammonium hydroxide is tetraethylammonium hydroxide. 
     
     
         7 . The substrate detergent composition according to  claim 1 , wherein the organic solvent is an organic solvent containing at least one hydroxyl group in one molecule and contains at least one kind of a saturated aliphatic alcohol having 1 to 8 carbon atoms, a glycol having 2 to 16 carbon atoms and a glycol ether having 4 to 20 carbon atoms. 
     
     
         8 . The substrate detergent composition according to  claim 2 , wherein the organic solvent is an organic solvent containing at least one hydroxyl group in one molecule and contains at least one kind of a saturated aliphatic alcohol having 1 to 8 carbon atoms, a glycol having 2 to 16 carbon atoms and a glycol ether having 4 to 20 carbon atoms. 
     
     
         9 . The substrate detergent composition according to  claim 3 , wherein the organic solvent is an organic solvent containing at least one hydroxyl group in one molecule and contains at least one kind of a saturated aliphatic alcohol having 1 to 8 carbon atoms, a glycol having 2 to 16 carbon atoms and a glycol ether having 4 to 20 carbon atoms. 
     
     
         10 . The substrate detergent composition according to  claim 4 , wherein the organic solvent is an organic solvent containing at least one hydroxyl group in one molecule and contains at least one kind of a saturated aliphatic alcohol having 1 to 8 carbon atoms, a glycol having 2 to 16 carbon atoms and a glycol ether having 4 to 20 carbon atoms. 
     
     
         11 . The substrate detergent composition according to  claim 5 , wherein the organic solvent is an organic solvent containing at least one hydroxyl group in one molecule and contains at least one kind of a saturated aliphatic alcohol having 1 to 8 carbon atoms, a glycol having 2 to 16 carbon atoms and a glycol ether having 4 to 20 carbon atoms. 
     
     
         12 . The substrate detergent composition according to  claim 6 , wherein the organic solvent is an organic solvent containing at least one hydroxyl group in one molecule and contains at least one kind of a saturated aliphatic alcohol having 1 to 8 carbon atoms, a glycol having 2 to 16 carbon atoms and a glycol ether having 4 to 20 carbon atoms. 
     
     
         13 . The substrate detergent composition according to  claim 1 , wherein the substrate to be cleaned is a thin substrate with thickness of 20 to 100 μm. 
     
     
         14 . The substrate detergent composition according to  claim 2 , wherein the substrate to be cleaned is a thin substrate with thickness of 20 to 100 μm. 
     
     
         15 . The substrate detergent composition according to  claim 3 , wherein the substrate to be cleaned is a thin substrate with thickness of 20 to 100 μm. 
     
     
         16 . The substrate detergent composition according to  claim 4 , wherein the substrate to be cleaned is a thin substrate with thickness of 20 to 100 μm. 
     
     
         17 . The substrate detergent composition according to  claim 5 , wherein the substrate to be cleaned is a thin substrate with thickness of 20 to 100 μm. 
     
     
         18 . The substrate detergent composition according to  claim 6 , wherein the substrate to be cleaned is a thin substrate with thickness of 20 to 100 μm. 
     
     
         19 . A thinning process for a substrate in which a semiconductor circuit is formed comprising: bonding the substrate to a support body using an adhesive; grinding a back side of the substrate; delaminating the support body with the adhesive; removing the adhesive remaining on the substrate surface using the substrate detergent composition according to  claim 1 . 
     
     
         20 . The thinning process for substrate according to  claim 19 , wherein the adhesive is a silicone-based adhesive.