Fiber pad flooring installation with low reflected sound pressure level

Abstract

A flooring system as disclosed herein may include a subfloor, a top floor layer, and an underlayment material comprising a needlepunched fiber pad. The needlepunched fiber pad may include a plurality of layers that are needlepunched together to form the fiber pad. Each of the layers may have a respective initial thickness. The fiber pad may have a thickness that is less than the sum of the initial thicknesses. A moisture vapor barrier may be disposed between the needlepunched fiber pad and the sub floor. A portion of the moisture vapor barrier may extend beyond an edge of the fiber pad. The portion of the moisture vapor barrier that extends beyond the edge of the fiber pad may have an adhesive disposed thereon.

1 . A flooring system, comprising:
 a subfloor;   a top floor layer; and   an underlayment material comprising a needlepunched fiber pad, wherein the needlepunched fiber pad comprises a plurality of layers that are needlepunched together to form the fiber pad.   
     
     
         2 . The flooring system of  claim 1 , wherein each of the layers has a respective initial thickness, and the needlepunched fiber pad has a thickness that is less than the sum of the initial thicknesses. 
     
     
         3 . The flooring system of  claim 1 , further comprising a moisture vapor barrier disposed between the needlepunched fiber pad and the sub floor. 
     
     
         4 . The flooring system of  claim 3 , wherein a portion of the moisture vapor barrier extends beyond an edge of the fiber pad. 
     
     
         5 . The flooring system of  claim 4 , wherein the portion of the moisture vapor barrier that extends beyond the edge of the fiber pad has an adhesive disposed thereon. 
     
     
         6 . A flooring system, comprising:
 a subfloor;   a top floor layer;   an underlayment material comprising a needlepunched fiber pad, and   a moisture vapor barrier disposed between the needlepunched fiber pad and the sub floor.   
     
     
         7 . The flooring system of  claim 6 , wherein the needlepunched fiber pad comprises a plurality of layers that are needlepunched together to form the fiber pad, wherein each of the layers has a respective initial thickness, and wherein the needlepunched fiber pad has a thickness that is less than the sum of the initial thicknesses. 
     
     
         8 . The flooring system of  claim 6 , wherein a portion of the moisture vapor barrier extends beyond an edge of the fiber pad. 
     
     
         9 . The flooring system of  claim 6 , wherein the portion of the moisture vapor barrier that extends beyond the edge of the fiber pad has an adhesive disposed thereon. 
     
     
         10 . An underlayment material for a flooring system, the underlayment material comprising:
 a needlepunched fiber pad; and   a moisture vapor barrier affixed to the needlepunched fiber pad;   wherein the needlepunched fiber pad comprises a plurality of layers that are needlepunched together to form the fiber pad, each of the layers has a respective initial thickness, and the needlepunched fiber pad has a thickness that is less than the sum of the initial thicknesses; and   wherein a portion of the moisture vapor barrier extends beyond an edge of the fiber pad an adhesive is disposed on the portion of the moisture vapor barrier that extends beyond the edge of the fiber pad, and the adhesive is covered by a tape.