US2014345830A1PendingUtilityA1
Dc motor device and dc fan using the same
Est. expiryMay 27, 2033(~6.8 yrs left)· nominal 20-yr term from priority
H10W 40/226H10W 40/73H10W 40/037F28D 15/02F28F 1/30F28F 2275/12F28D 15/0275F28D 15/0233
40
PatentIndex Score
0
Cited by
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Claims
Abstract
A heat dissipating device includes a substrate, a plurality of fins, and a heat pipe. The substrate has a plurality of retaining holes. Each of the fins includes a heat dissipating sheet and a retaining sheet extended from the heat dissipating sheet and passing through one of the retaining holes. The heat pipe is disposed on the fins.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A heat dissipating device, comprising:
a substrate having a plurality retaining holes; a plurality of first fins, wherein each of the first fins comprises:
a heat dissipating sheet having a receiving hole;
a contacting sheet extending from the heat dissipating sheet; and
a retaining sheet, extending from the heat dissipating sheet, passing through one of the retaining holes; and
a heat pipe, disposed on the receiving hole, contacting with the contacting sheet.
2 . The heat dissipating device as claimed in claim 1 , wherein the contacting sheet and the retaining sheet are substantially perpendicular to the heat dissipating sheet.
3 . The heat dissipating device as claimed in claim 1 , wherein the retaining sheet and the contacting sheet are substantially parallel to the substrate.
4 . The heat dissipating device as claimed in claim 1 , wherein the retaining sheet and the heat dissipating sheet are respectively located at two opposite sides of the substrate.
5 . The heat dissipating device as claimed in claim 1 , wherein the first fins are sheet structures, and the heat dissipating sheet, the contacting sheet, and the retaining sheet are formed as a single piece.
6 . The heat dissipating device as claimed in claim 1 , further comprising a plurality of second fins disposed on the substrate,
wherein the first fins and the second fins are alternately overlaid to each other, and the second fins do not pass through the retaining holes.
7 . A heat dissipating device, comprising:
a substrate having retaining hole; a plurality of first fins, wherein each of the first fins comprises:
a heat dissipating sheet having a receiving hole;
a contacting sheet, extending from the heat dissipating sheet, having a first end; and
a first retaining sheet, extending from the first end, passing through the retaining hole; and
a heat pipe, disposed on the receiving hole, contacting with the contacting sheet.
8 . The heat dissipating device as claimed in claim 7 , wherein the contacting sheet and the first retaining sheet are substantially perpendicular to the heat dissipating sheet.
9 . The heat dissipating device as claimed in claim 7 , wherein the first retaining sheet and the contacting sheet are substantially parallel to the substrate.
10 . The heat dissipating device as claimed in claim 7 , wherein the first retaining sheet and the heat dissipating sheet are respectively located at two opposite sides of the substrate.
11 . The heat dissipating device as claimed in claim 7 , wherein the first fins is a sheet structure, and the heat dissipating sheet, the contacting sheet, and the first retaining sheet are formed as a single piece.
12 . The heat dissipating device as claimed in claim 7 , wherein the contacting sheet has a second end, and the first fins further comprises a second retaining sheet extending from the second end and fastening on the heat pipe.
13 . The heat dissipating device as claimed in claim 7 , further comprising a plurality of second fins, disposed on the substrate, but not passing through the retaining hole,
wherein the first fins and the second fins are overlapped along an arrangement direction, and the first fins are located between the second fins.
14 . The heat dissipating device as claimed in claim 13 , wherein each of the second fins comprises a fastening portion fastened on the heat pipe.Join the waitlist — get patent alerts
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