Ultraviolet-curable resin material for pattern transfer and magnetic recording medium manufacturing method using the same

Abstract

According to one embodiment, an ultraviolet curing curable resin material for pattern transfer is provided. The resin contains isobornyl acrylate, an acrylate having a fluorene skeleton, a polyfunctional acrylate, and a polymerization initiator.

What is claimed is: 
     
         1 . A method for manufacturing a semiconductor device comprising:
 bringing a semiconductor substrate and a transparent stamper into contact with each other by a coating layer comprising an uncured ultraviolet-curable resin material for pattern transfer containing isobornyl acrylate, an acrylate having a fluorene skeleton represented by formula (1), a polyfunctional acrylate, and a polymerization initiator, the coating layer being interposed between the semiconductor substrate and the transparent stamper,   
       
         
           
           
               
               
           
         
       
       wherein each of R 1  and R 2  is selected from the group consisting of H, —C 2 H 4 —OCOCH═CH 2 , —C 3 H 6 —OCOCH═CH 2 , —CH 4 H 8 —OCOCH═CH 2 , 
       
         
           
           
               
               
           
         
       
       and each of R 3  and R 4  is selected from the group consisting of H, —CH 3 , —C 2 H 5 , —C 3 H 7 , —C 4 H 9 , —Cl, —F, —Br, —NH 2 , —OH, and —OCOCH═CH 2 ;
 irradiating the coating layer with ultraviolet light, thereby curing the ultraviolet-curable resin material for pattern transfer; and 
 removing the transparent stamper to form, on one surface of the semiconductor substrate, a cured ultraviolet-curable resin material layer for pattern transfer onto which a three-dimensional pattern is transferred. 
 
     
     
         2 . The method of  claim 1 , wherein the ultraviolet-curable resin material contains
 10 to 62% by weight of isobornyl acrylate,   10 to 50% by weight of the acrylate having a fluorene skeleton,   10 to 44% by weight of the polyfunctional acrylate, and   0.1 to 6% by weight of the polymerization initiator.   
     
     
         3 . A method for manufacturing a semiconductor device comprising:
 bringing a semiconductor substrate and a transparent stamper into contact with each other by a coating layer comprising an uncured ultraviolet-curable resin material for pattern transfer containing isobornyl acrylate, an acrylate having a fluorene skeleton represented by formula (1), a polyfunctional acrylate, an acrylate having an adamantane skeleton, and a polymerization initiator, the coating layer being interposed between the semiconductor substrate and the transparent stamper,   
       
         
           
           
               
               
           
         
       
       wherein each of R 1  and R 2  is selected from the group consisting of H, —C 2 H 4 —OCOCH═CH 2 , —C 3 H 6 —OCOCH═CH 2 , —CH 4 H 8 —OCOCH═CH 2 , 
       
         
           
           
               
               
           
         
       
       and each of R 3  and R 4  is selected from the group consisting of H, —CH 3 , —C 2 H 5 , —C 3 H 7 , —C 4 H 9 , —Cl, —F, —Br, —NH 2 , —OH, and —OCOCH═CH 2 ;
 irradiating the coating layer with ultraviolet light, thereby curing the ultraviolet-curable resin material for pattern transfer; and 
 removing the transparent stamper to form, on one surface of the semiconductor substrate, a cured ultraviolet-curable resin material layer for pattern transfer onto which a three-dimensional pattern is transferred. 
 
     
     
         4 . The method of  claim 3 , wherein the acrylate having an adamantane skeleton is present in a weight percent between about 0 and 40.