Seep resistant masking material
Abstract
A masking material and method of forming a masking tape that includes a substrate and an adhesive layer disposed on the substrate. The adhesive layer is preferably thicker than the substrate and formed of a material that has a modulus of elasticity combined with a viscoelastic component that allows the adhesive to conform to discontinuities associated with a surface to which the masking material is applied. Preferably, the adhesive is formed in two rows that are aligned with the lateral edges of the substrate and which prevent seepage of liquid materials between the masking material and the surface to which it is applied.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A method of forming a masking tape comprising:
applying multiple rows of adhesive to a backer material; forming an elongated roll by rolling the backer material onto itself so that the multiple rows of adhesive are captured between adjacent layers of backer material; and partitioning the elongate roll into discrete rolls by cutting the elongate roll at locations that divide at least one of the multiple rows of adhesive into a first portion that is associated with an edge of a first discrete roll and a second portion that is associated with an edge of a second discrete roll.
2 . The method of claim 1 wherein applying multiple rows of adhesive is further defined as applying, a bead of an adhesive selected from the group consisting of polyurethane gel adhesive, silicone gel adhesive, and acrylics to a surface of the backer material.
3 . The method of claim 1 wherein the step of applying multiple rows of adhesive is further defined as applying the bead of adhesive at a width that is between about 0.040 inches and about 0.180 inches.
4 . The method of claim 1 wherein the step of applying multiple rows of adhesive is further defined as applying the bead of adhesive at a thickness that is greater than 0.003 inches.
5 . The method of claim 1 wherein the step of applying multiple rows of adhesive is further defined as applying the bead of adhesive at a thickness that is greater than 0.010 inches.
6 . The method of claim 1 further comprising partitioning the elongate roll at a location between adjacent rows of adhesive such that at least one of the discrete rolls has adhesive associated with only one edge of a respective discrete roll.
7 . The method of claim 1 wherein forming the elongate roll distributes the multiple rows of adhesive such that the adhesive extends uninterrupted between alternate edges of the backer material.
8 . A method of forming a masking tape material comprising:
selecting an adhesive to be elastically deformable and to have a stiffness value that is insufficient to overcome a tack value associated with interaction of the selected adhesive with an intended application surface; selecting a backer material for supporting the selected adhesive; and applying the selected adhesive to the selected backer material such that the adhesive extends from the selected backer material at least 0.003 inches.
9 . The method of claim 8 wherein selecting the adhesive includes selecting an adhesive that is elastically deformation at least more than 1.25 times an at rest thickness of the respective adhesive.
10 . The method of claim 8 wherein selecting the adhesive is further defined as selecting the adhesive from at least one of polyurethane gel adhesives, silicone gel adhesives, and acrylic gel adhesives.
11 . The method of claim 8 wherein the backer material is selected from one of a plastic material, a cloth material, and a paper material.
12 . The method of claim 11 wherein the backer material is selected to be tearable in a crossing direction relative to a longitudinal axis of the backer material.
13 . The method of claim 8 further comprising forming a roll from sequential layers of the selected backer material and selected adhesive after the selected adhesive has been applied to the selected backer material.
14 . The method of claim 13 further comprising forming multiple rolls from the formed roll.
15 . A method of masking surfaces, the method comprising:
exposing an adhesive that is disposed along at least one edge of a substrate and extends in an outward direction from the substrate to define a thickness of the adhesive that is greater than 0.003 inches; and elastically deforming the exposed adhesive by to at least more than 1.25 times an at rest thickness of the adhesive without separation between the adhesive and the substrate.
16 . The method of claim 15 further comprising exposing more than one row of adhesive such that respective rows of adhesive are oriented along alternate edges of the substrate,
17 . The method of claim 16 further comprising maintaining a gap between adjacent rows of adhesive and a space between the substrate, adjacent rows of adhesive, and an application surface during placement of the substrate relative to the application surface.
18 . The method of claim 15 further comprising tearing the substrate and the adhesive along a tear-line without separating the adhesive from the substrate.
19 . The method of claim 15 wherein exposing the adhesive is further defined as unrolling the adhesive and substrate.
20 . The method of claim 15 further comprising removing the elastically deformed adhesive from an application surface via interaction with the substrate.Join the waitlist — get patent alerts
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