US2014331928A1PendingUtilityA1
Method of forming a germanium thin film
Est. expiryMar 2, 2032(~5.6 yrs left)· nominal 20-yr term from priority
H10P 14/3411H10P 14/3248H10P 14/3238H10P 14/3211H10P 14/27H10P 14/24H10P 72/0402H01L 21/67017H01L 21/02636H01L 21/02532
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Claims
Abstract
A method of forming a germanium thin film on an underlying film includes forming a germanium seed layer by absorbing a germanium on a surface of the underlying film using an aminogermane-based gas, and forming a germanium thin film on the germanium seed layer using a germane-based gas.
Claims
exact text as granted — not AI-modified1 . A germanium thin film formation apparatus which forms a germanium thin film on an underlying film, the germanium thin film formation apparatus comprising:
a process chamber which houses an object to be processed having the underlying film on which the germanium thin film is to be formed; a process gas supplying mechanism which supplies gas used for a process into the process chamber; a heating device which heats the object to be processed housed in the process chamber; an exhauster which evacuates the interior of the process chamber; and a controller configured to control the process gas supplying mechanism, the heating device, and the exhauster, wherein the controller controls the process gas supplying mechanism to: supply a aminogermane-based gas to the process chamber to form a germanium seed layer on an underlying film by absorbing a germanium on the surface of the underlying film; and supply a germane-based gas to the process chamber to form a germanium thin film on the germanium seed layer; and wherein the controller controls the heating device to set a process temperature inside the process chamber to a range of 200 to 500 degrees C.
2 . The apparatus of claim 1 , wherein the surface of the underlying film contains moisture.
3 . The apparatus of claim 1 , wherein moisture is applied on the surface of the underlying film before forming the germanium seed layer.
4 . The apparatus of claim 1 , wherein the surface of the underlying film is exposed to a moisture-containing gas before forming the germanium seed layer.
5 . The apparatus of claim 4 , wherein the moisture-containing gas is atmosphere.
6 . The apparatus of claim 1 , wherein the surface of the underlying film is washed with water before forming the germanium seed layer.
7 . The apparatus of claim 2 , wherein the moisture is selected from a hydroxyl group.
8 . The apparatus of claim 1 , wherein the aminogermane-based gas includes at least one selected from a group consisting of the following gases:
GeH(NMe 2 ) 3 , GeH(NMeEt) 3 , GeH(NEt 2 ) 3 , GeH(NHEt) 3 , GeH(NHi-Pr) 3 , GeH(NHt-Bu) 3 , GeH 2 (NMe 2 ) 2 , GeH 2 (NMeEt) 2 , GeH 2 (NEt 2 ) 2 , GeH 2 (NHi-Pr) 2 , GeH 2 (NHt-Bu) 2 , GeH 3 (NMe 2 ), GeH 3 (NMeEt), GeH 3 (NEt 2 ), GeH 3 (NHEt), GeH 3 (NHi-Pr), and GeH 3 (NHt-Bu).
9 . The apparatus of claim 1 , wherein the germane-based gas includes at least one selected from a group consisting of the following gases:
GeH 4 , Ge 2 H 6 , GeCl 4 , GeHCl 3 , GeH 2 Cl 2 , and GeH 3 Cl.
10 . The apparatus of claim 1 , wherein the germanium thin film is doped with a dopant containing at least one selected from a group consisting of the following elements:
Boron (B), Phosphorus (P), Arsenic (As), Oxygen (O), Carbon (C), and Nitrogen (N).Join the waitlist — get patent alerts
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