Packaged ic having printed dielectric adhesive on die pad

Abstract

A packaged integrated circuit (IC) includes a leadframe having metal terminals positioned outside the die pad. An IC die having a top side including a plurality of bond pads is placed with its bottom side onto attached by a dielectric polymer material to the die pad. Bond wires are between the plurality of bond pads and the metal terminals of the leadframe. A mold material different from said dielectric polymer material provides encapsulation for the packaged IC. An area of the dielectric polymer material exceeds an area of the IC die. The dielectric polymer material forms a dielectric polymer/mold material interface with the mold material.

We claim: 
     
         1 - 20 . (canceled) 
     
     
         21 . A packaged integrated circuit (IC), comprising:
 a leadframe including metal terminals positioned outside a die pad;   at least one IC die having a plurality of bond pads on its top side having its bottom side attached by a dielectric polymer material to said die pad;   bond wires between said plurality of bond pads and said metal terminals;   a mold material different from said dielectric polymer material providing encapsulation for said packaged IC, wherein an area of said dielectric polymer material exceeds an area of said IC die, wherein said dielectric polymer material forms a dielectric polymer/mold material interface with said mold material.   
     
     
         22 . The packaged IC of  claim 21 , wherein said dielectric polymer material extends laterally beyond said area of said IC die throughout said area of said IC die. 
     
     
         23 . The packaged IC of  claim 21 , wherein said dielectric polymer material provides substantially vertical outer walls between 80 and 100 degrees relative to a top surface of said die pad. 
     
     
         24 . The packaged IC of  claim 21 , wherein said leadframe comprises a leadless leadframe. 
     
     
         25 . The packaged IC of  claim 21 , wherein said at least one IC die comprises at least a first IC die and a second IC die positioned lateral to one another on said die pad to provide a multi-chip module (MCM). 
     
     
         26 . The packaged IC of  claim 25 , wherein said die pad is a split die pad. 
     
     
         27 . The packaged IC of  claim 25 , wherein said die pad consists of a single die pad. 
     
     
         28 . The packaged IC of  claim 21 , wherein said dielectric polymer material comprises a crosslinked epoxy.