Methods and apparatus using energized fluids to clean chemical mechanical planarization polishing pads

Abstract

Methods adapted to clean a chemical mechanical polishing (CMP) pad are disclosed. The methods include positioning an energized fluid delivery assembly over a CMP polishing pad; rotating the polishing pad on a platen; energizing a fluid within the energized fluid delivery assembly; applying the energized fluid to the polishing pad to dislodge slurry residue and debris; and removing the dislodged slurry residue and debris using a vacuum suction unit. Systems and apparatus for carrying out the methods are provided, as are numerous additional aspects.

The invention claimed is: 
     
         1 . A chemical mechanical polishing (CMP) system comprising:
 a polishing pad configured to be rotated on a platen;   a polishing head configured to hold a substrate against the polishing pad; and   an energized fluid delivery assembly configured to apply an energized fluid to the polishing pad to dislodge slurry residue and debris from the polishing pad.   
     
     
         2 . The CMP system of  claim 1  wherein the energized fluid delivery assembly includes an acoustically energized fluid delivery unit configured to impart acoustic energy to a fluid and to direct the energized fluid toward the polishing pad. 
     
     
         3 . The CMP system of  claim 1  wherein the energized fluid delivery assembly includes a pressurized gas energized fluid delivery unit configured to impart energy in the form of pressurized gas to a liquid and to direct the energized fluid toward the polishing pad. 
     
     
         4 . The CMP system of  claim 1  wherein the energized fluid delivery assembly includes a thermally energized fluid delivery unit configured to impart thermal energy to a liquid sufficient to cause the liquid to change state to a gas and to direct the energized fluid toward the polishing pad. 
     
     
         5 . The CMP system of  claim 1  further including a vacuum suction unit configured to remove slurry residue and debris dislodged by application of the energized fluid to the polishing pad. 
     
     
         6 . The CMP system of  claim 1  further including a controller operative to monitor the polishing pad to determine if the polishing pad has been cleaned. 
     
     
         7 . The CMP system of  claim 1  wherein the polishing pad is configured to be cleaned when CMP processing is not being performed. 
     
     
         8 . An apparatus for cleaning a chemical mechanical polishing (CMP) polishing pad, the apparatus comprising:
 an energized fluid delivery assembly configured to energize a fluid and apply the energized fluid to a CMP polishing pad to dislodge slurry residue and debris from the polishing pad; and   a vacuum suction unit configured to remove the dislodged slurry residue and debris.   
     
     
         9 . The apparatus of  claim 8  wherein the energized fluid delivery assembly includes an acoustically energized fluid delivery unit configured to impart acoustic energy to a fluid and to direct the energized fluid toward the polishing pad. 
     
     
         10 . The apparatus of  claim 8  wherein the energized fluid delivery assembly includes a pressurized gas energized fluid delivery unit configured to impart energy in the form of pressurized gas to a liquid and to direct the energized fluid toward the polishing pad. 
     
     
         11 . The apparatus of  claim 8  wherein the energized fluid delivery assembly includes a thermally energized fluid delivery unit configured to impart thermal energy to a liquid sufficient to cause the liquid to change state to a gas and to direct the energized fluid toward the polishing pad. 
     
     
         12 . The apparatus of  claim 8  further including a controller operative to monitor the polishing pad to determine if the polishing pad has been cleaned. 
     
     
         13 . The apparatus of  claim 8  wherein the apparatus is configured to clean the polishing pad when CMP processing is not being performed with the polishing pad. 
     
     
         14 . A method of cleaning a chemical mechanical polishing (CMP) pad, the method comprising:
 positioning an energized fluid delivery assembly over a CMP polishing pad;   rotating the polishing pad on a platen;   energizing a fluid within the energized fluid delivery assembly;   applying the energized fluid to the polishing pad to dislodge slurry residue and debris; and   removing the dislodged slurry residue and debris using a vacuum suction unit.   
     
     
         15 . The method of  claim 14  wherein energizing a fluid within the energized fluid delivery assembly includes energizing the fluid within an acoustically energized fluid delivery unit configured to impart acoustic energy to the fluid. 
     
     
         16 . The method of  claim 14  wherein energizing a fluid within the energized fluid delivery assembly includes energizing the fluid within a pressurized gas energized fluid delivery unit configured to impart energy in the form of pressurized gas to a liquid. 
     
     
         17 . The method of  claim 14  wherein energizing a fluid within the energized fluid delivery assembly includes energizing a fluid within a thermally energized fluid delivery unit configured to impart thermal energy to a liquid sufficient to cause the liquid to change state to a gas. 
     
     
         18 . The method of  claim 14  further including monitoring the polishing pad to determine if the polishing pad has been cleaned. 
     
     
         19 . The method of  claim 14  wherein applying the energized fluid to the polishing pad is performed when CMP processing is not being performed. 
     
     
         20 . A system comprising:
 a processor; and   a memory storing instructions executable by the processor, the instructions operative to:
 position an energized fluid delivery assembly over a CMP polishing pad; 
 rotate the polishing pad on a platen; 
 energize a fluid within the energized fluid delivery assembly; 
 apply the energized fluid to the polishing pad to dislodge slurry residue and debris; and 
 remove the dislodged slurry residue and debris using a vacuum suction unit.