Surface polymer coatings

Abstract

A plasma chamber ( 11′ ) for coating a substrate with a polymer layer, the plasma chamber comprises a first electrode set ( 14′ ) and a second electrode set ( 14′ ), the first and second electrode sets are arranged either side of a sample chamber for receiving a substrate, wherein the first and second electrode sets comprise plural electrode layers ( 141′, 142′ ) and wherein each electrode set comprises plural radiofrequency electrode layers or plural ground electrode layers for coating polymer to each surface of a substrate.

1 - 42 . (canceled) 
     
     
         43 . A plasma chamber for coating a substrate with a polymer layer, the plasma chamber having at least first and second electrode sets being spaced apart to accommodate a substrate to be coated, wherein the first and second electrode sets each comprise three electrode layers and wherein each electrode set comprises either one radiofrequency electrode layer and two ground electrode layers or two radio frequency electrode layers and one ground electrode layer. 
     
     
         44 . The plasma chamber according to  claim 43 , wherein the plasma chamber comprises additional third or fourth or fifth or sixth electrode sets. 
     
     
         45 . The plasma chamber according to  claim 43  comprising at least one inlet for introducing a monomer thereto and wherein the at least one inlet feeds the monomer into a monomer distribution system that distributes the monomer evenly across the chamber. 
     
     
         46 . The plasma chamber according to  claim 43 , wherein at least one of the radio frequency electrode layers includes heat regulator means capable of regulating the temperature inside the chamber, when in use, from room temperature to 70° C. 
     
     
         47 . The plasma chamber according to  claim 46 , wherein the heat regulator means comprises hollow tubing having a diameter of 2.5 mm to 100 mm and a wall thickness of from 0.1 mm to 10 mm, and the hollow tubing is adapted to transport a heat transfer fluid. 
     
     
         48 . A method for coating a substrate with a polymer layer, which method comprises:
 locating a first electrode set and a second electrode set within a plasma chamber;   placing a substrate between the first electrode set and the second electrode set, wherein each electrode set comprises an inner layer and a pair of outer layers wherein the inner layer is either a radiofrequency electrode layer or a ground electrode layer and the outer layers are either ground or radiofrequency electrode layers respectively;   introducing a monomer into the plasma chamber;   switching on the radiofrequency electrode layer or layers in order to activate a plasma; and   exposing surfaces of a substrate to the plasma such that a polymer layer is deposited on each surface.   
     
     
         49 . The method of  claim 48 , further comprising the step of activating the plasma with the monomer to form the polymer layer. 
     
     
         50 . The method of  claim 48 , wherein the polymer layer has a thickness from 10 to 500 nm. 
     
     
         51 . The method of  claim 48 , further comprising drawing a fixed flow of the monomer into the plasma chamber using a monomer vapour supply system. 
     
     
         52 . The method of  claim 48 , further comprising the step of allowing a vapour pressure of the monomer to stabilize in the chamber before activating the plasma by switching on a radiofrequency electrode layer or layers. 
     
     
         53 . The method of  claim 48 , further comprising the step of introducing the monomer into the plasma chamber in a first flow direction; and switching the flow after a predetermined time to a second flow direction. 
     
     
         54 . The method of  claim 48 , further comprising the step of depositing a polymer coating having a contact angle for water of 100° or more and/or an oil repellency level of 4 or more according to ISO14419 in a process time of approximately 2 minutes or less. 
     
     
         55 . A substrate having a solder-through polymer layer formed by depositing a monomer using a low power continuous or pulsed wave plasma polymerisation technique, wherein the monomer comprises the general formula: C n F 2n+1 C m  X 2m CR 3 Y—OCO—C(R 4 )=CH 2 , wherein n is 2 to 9, preferably 2 to 6, m is 0 to 9, X and Y are H, F, Cl, Br or I, R 3  is H, alkyl or substituted alkyl; and R 4  is —H, alkyl or substituted alkyl. 
     
     
         56 . The substrate according to  claim 55 , wherein the polymer layer comprises a thickness of from 10 to 500 nm. 
     
     
         57 . The substrate according to  claim 55 , wherein the polymer layer has a uniformity variation of less than 10%.