US2014322510A1PendingUtilityA1

Gas barrier film

Assignee: KONICA MINOLTA INCPriority: Dec 16, 2011Filed: Dec 10, 2012Published: Oct 30, 2014
Est. expiryDec 16, 2031(~5.4 yrs left)· nominal 20-yr term from priority
Inventors:Shoji Nishio
C08J 7/0423C08J 2369/00C08J 7/06C08J 2483/16B32B 27/16C08J 2483/08B32B 2307/306C08J 2367/02B32B 27/283B32B 2307/412B32B 2255/10B32B 2255/26C08J 2465/00B32B 27/08B32B 2457/20C08J 2483/06B32B 2307/72Y10T428/24992B32B 2307/584C08J 2381/06B32B 2307/7242C08J 7/042H05K 5/065C08J 7/048C08J 7/046C08J 7/056C08J 7/043
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Claims

Abstract

A gas barrier film includes at least one gas barrier layer and a protective layer over a substrate. The protective layer contains organosilicon and is disposed on the gas barrier layer. At least part of the gas barrier layer has a composition SiO x N y where a condition 0.1≦x/(x+y)≦0.9 is satisfied. The protective layer has received a modification treatment, which is irradiation with ultraviolet light having a wavelength of 300 nm or less. A ratio of a density of the protective layer to a density of the gas barrier layer is 0.2 or more and 0.75 or less.

Claims

exact text as granted — not AI-modified
1 . A gas barrier film comprising at least one gas barrier layer and a protective layer over a substrate, the protective layer containing organosilicon and being disposed on the gas barrier layer, wherein
 at least part of the gas barrier layer has a composition SiO x N y  where a condition 0.1≦x/(x+y)≦0.9 is satisfied,   the protective layer has received a modification treatment, which is irradiation with ultraviolet light having a wavelength of 300 nm or less, and   a ratio of a density of the protective layer to a density of the gas barrier layer is 0.2 or more and 0.75 or less.   
     
     
         2 . The gas barrier film according to  claim 1 , wherein the substrate has a thermal expansion rate of 100 ppm/° C. or less and a glass-transition temperature of 120° C. or more. 
     
     
         3 . The gas barrier film according to  claim 1 , wherein the gas barrier layer is formed by performing a modification treatment to a coating film containing polysilazane, the modification treatment being irradiation with ultraviolet light having a wavelength of 400 nm or less. 
     
     
         4 . The gas barrier film according to  claim 1 , wherein the protective layer comprises material containing a siloxane bond. 
     
     
         5 . The gas barrier film according to  claim 1 , wherein, on each side of one of the gas barrier layer and the protective layer, the other of the gas barrier layer and the protective layer is disposed. 
     
     
         6 . The gas barrier film according to  claim 1 , wherein the modification treatment is irradiation with vacuum ultraviolet light having a wavelength of less than 180 nm.

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