Method and apparatus for thermoelectric cooling of fluids

Abstract

The present disclosure provides a method and a thermoelectric cooling apparatus for cooling a fluid. The thermoelectric cooling apparatus comprises one or more of thermoelectric devices, a hot sink, a cold sink, and a heat rejection apparatus which comprises condenser fins and a fan to attain a high figure of merit. The heat from the fluid is transferred to the hot sink and/or one or more heat pipes by the one or more thermoelectric devices. The heat from the one or more heat pipes is dissipated to the ambient through condenser fins and the fan.

What is claimed is: 
     
         1 . A thermoelectric cooling apparatus comprising:
 one or more thermoelectric devices comprising a hot side and a cold side, wherein the one or more thermoelectric devices are configured to cool a fluid;   one or more metal standoffs comprising a first side and a second side, the first side of the one or more metal standoffs being attached to the cold side of the one or more thermoelectric devices, wherein the one or more metal standoffs are configured to transfer heat to the cold side of the one or more thermoelectric devices;   a cold sink attached to the second side of the one or more metal standoffs, the cold sink being configured to transfer heat from the fluid to the one or more metal standoffs;   one or more heat pipes comprising a first end and a second end, the first end being attached to the hot side of the one or more thermoelectric devices, wherein the one or more heat pipes are configured to assist in transfer of heat from the hot side of the one or more thermoelectric devices to an ambient; and   condenser fins attached to the second end of the one or more heat pipes, the condenser fins configured to assist in dissipating heat from the second end of the one or more heat pipes to the ambient.   
     
     
         2 . The thermoelectric cooling apparatus in accordance with  claim 1 , the thermoelectric cooling apparatus further comprises a hot sink attached to the first end of the one or more heat pipes, wherein the hot sink is configured to assist in dissipating heat from the first end of the one or more heat pipes. 
     
     
         3 . The thermoelectric cooling apparatus in accordance with  claim 2 , the thermoelectric cooling apparatus further comprises a plurality of screws, wherein the plurality of screws is configured to facilitate attachment of the hot sink and the cold sink. 
     
     
         4 . The thermoelectric cooling apparatus in accordance with  claim 2 , the thermoelectric cooling apparatus further comprising a plurality of grommets, wherein the plurality of grommets is configured to prevent heat conduction from the hot sink to the cold sink. 
     
     
         5 . The thermoelectric cooling apparatus in accordance with  claim 2 , the thermoelectric cooling apparatus further comprising a hot sink fan thermally coupled to the hot sink, wherein the fan is configured to dissipate heat from the hot sink to the ambient. 
     
     
         6 . The thermoelectric cooling apparatus in accordance with  claim 1 , the thermoelectric cooling apparatus further comprising a fan thermally coupled to the condenser fins, wherein the fan is configured to dissipate heat from the condenser fins to the ambient. 
     
     
         7 . The thermoelectric cooling apparatus in accordance with  claim 1 , the thermoelectric cooling apparatus further comprising an evaporator plate thermally coupled to the hot side of the one or more thermoelectric devices, wherein the evaporator plate is configured to collect heat from the hot side of the one or more thermoelectric devices. 
     
     
         8 . The thermoelectric cooling apparatus in accordance with  claim 1 , wherein the cold sink comprises at least one of anodized aluminum, copper and nickel. 
     
     
         9 . The thermoelectric cooling apparatus in accordance with  claim 1 , the thermoelectric cooling apparatus further comprising an insulation material, wherein the insulation material is configured to fill gaps between elements of the thermoelectric cooling apparatus. 
     
     
         10 . The thermoelectric cooling apparatus in accordance with  claim 1 , the thermoelectric cooling apparatus further comprising a thermal diode positioned between the hot side of the one or more thermoelectric devices and the one or more heat pipes, wherein the thermal diode is configured for unidirectional heat transfer. 
     
     
         11 . The thermoelectric cooling apparatus in accordance with  claim 1 , the thermoelectric cooling apparatus further comprising one or more containers containing the fluid, wherein one of the one or more containers is configured to function as a thermal capacitor. 
     
     
         12 . A thermoelectric cooling apparatus comprising:
 one or more thermoelectric devices comprising a hot side and a cold side, wherein the one or more thermoelectric devices is configured to cool a fluid;   a cold sink attached to the cold side of the one or more thermoelectric devices, the cold sink being configured to transfer heat from the fluid to the one or more thermoelectric devices;   one or more diodic heat pipes comprising a first end and a second end, the first end of one or more diodic heat pipes being attached to the hot side of the one or more thermoelectric devices, wherein the one or more diodic heat pipes are configured to facilitate transfer heat from the hot side of the one or more thermoelectric devices to an ambient; and   a fin array attached to the second end of the one or more heat pipes, wherein the fin array is configured to transfer heat from the second end of the one or more heat pipes.   
     
     
         13 . The thermoelectric cooling apparatus in accordance with  claim 12 , the thermoelectric cooling apparatus further comprising condenser fins attached to the one or more heat pipes, wherein the condenser fins are configured to assist in dissipation of heat from the one or more heat pipes. 
     
     
         14 . The thermoelectric cooling apparatus in accordance with  claim 13 , the thermoelectric cooling apparatus further comprising a fan thermally coupled to the condenser fins, wherein the fan is configured to dissipate heat from the condenser fins to the ambient. 
     
     
         15 . A thermoelectric cooling apparatus comprising:
 one or more thermoelectric devices comprising a hot side and a cold side, wherein the one or more thermoelectric devices is configured to cool a fluid;   one or more metal standoffs comprising a first side and a second side, the first side of the one or more metal standoffs being attached to the cold side of the one or more thermoelectric devices, wherein the one or more metal standoffs are configured to transfer heat to the cold side of the one or more thermoelectric devices;   one or more cold sinks attached to the second side of the one or more metal standoffs, the cold sink being configured to transfer heat from the fluid to the one or more metal standoffs; and   one or more heat pipes comprising a first end and a second end, the first end of the one or more heat pipes being attached to the hot side of the one or more thermoelectric devices, wherein the one or more heat pipes are configured to assist in dissipating heat from the hot side of the one or more thermoelectric devices to the ambient.   
     
     
         16 . The thermoelectric cooling apparatus in accordance with  claim 15 , the thermoelectric cooling apparatus further comprising condenser fins and a fan, the condenser fins being in close proximity to the second end of the one or more heat pipes, wherein the condenser fins and the fan are configured to dissipate heat from the one or more heat pipes to the ambient. 
     
     
         17 . The thermoelectric cooling apparatus in accordance with  claim 15 , wherein the one or more heat pipes further comprise an insulated section to prevent the conduction of heat from the second end to the first end of the one or more heat pipes. 
     
     
         18 . The thermoelectric cooling apparatus in accordance with  claim 15 , the thermoelectric cooling apparatus further comprising an evaporator plate thermally coupled to the hot side of the one or more thermoelectric devices, wherein the evaporator plate is configured to collect heat from the hot side of the one or more thermoelectric devices. 
     
     
         19 . A thermoelectric cooling apparatus comprising:
 one or more thermoelectric devices comprising a hot side and a cold side, wherein the one or more thermoelectric devices are configured to cool a fluid;   one or more metal standoffs comprising a first side and a second side, the first side of the one or more metal standoffs being attached to the cold side of the one or more thermoelectric devices, wherein the one or more metal standoffs are configured to transfer heat to the cold side of the one or more thermoelectric devices;   a cold sink attached to the second side of the one or more metal standoffs, the cold sink being configured to transfer heat from the fluid to the one or more metal standoffs; and   a separator configured to direct the fluid towards the cold sink.   
     
     
         20 . The thermoelectric cooling apparatus in accordance with  claim 19 , the thermoelectric cooling apparatus further comprising a convective heat dissipation apparatus thermally coupled to the hot side of the one or more thermoelectric devices, the convective heat dissipation apparatus being configured to remove heat from the hot side of the one or more thermoelectric devices to the ambient, wherein the convective heat dissipation apparatus comprises a convective fluid for heat transportation, a heat spreader, a pump, fins and a fan. 
     
     
         21 . The thermoelectric cooling apparatus in accordance with  claim 19 , wherein the separator comprises a plurality of pores. 
     
     
         22 . A thermoelectric cooling apparatus comprising:
 one or more thermoelectric devices comprising a hot side and a cold side, wherein the one or more thermoelectric devices are configured to cool a fluid;   one or more metal standoffs comprising a first side and a second side, the first side of the one or more metal standoffs being attached to the cold side of the one or more thermoelectric devices, wherein the one or more metal standoffs are configured to transfer heat to the cold side of the one or more thermoelectric devices;   a cold sink attached to the second side of the one or more metal standoffs, the cold sink being configured to transfer heat from the fluid to the one or more metal standoffs; and   a heat pipe-heat sink assembly attached to the hot side of the one or more thermoelectric devices, wherein the heat pipe-heat sink assembly is configured to dissipate heat from the hot side of the one or more thermoelectric devices to the ambient.   
     
     
         23 . The thermoelectric cooling apparatus in accordance with  claim 22 , the thermoelectric cooling apparatus further comprising a fan thermally coupled to the heat pipe-heat sink assembly, wherein the fan is configured to dissipate heat from the heat pipe-heat sink assembly to the ambient. 
     
     
         24 . A method of cooling a fluid by using a thermoelectric apparatus, comprising:
 operating the thermoelectric apparatus at optimum conditions when the temperature of the fluid is not within a predetermined temperature range;   determining the temperature of the fluid at predetermined time intervals; and   operating the thermoelectric apparatus at steady state conditions when the temperature of the fluid is within the predetermined temperature range.   
     
     
         25 . The method according to  claim 24 , wherein operating the thermoelectric cooling apparatus at optimum conditions includes supplying an optimum current (I opt ) to the thermoelectric cooling apparatus. 
     
     
         26 . The method according to  claim 24 , wherein operating the thermoelectric apparatus at steady state conditions includes supplying a steady state current (I ss ) to the thermoelectric apparatus. 
     
     
         27 . A method of operating a thermoelectric cooling apparatus for cooling a fluid, the method comprising:
 selecting at least one mode of operation from a plurality of modes of operation for the thermoelectric cooling apparatus; and   supplying maximum voltage (V max ) or minimum voltage (V min ) to the thermoelectric cooling apparatus based on the selected mode of operation.   
     
     
         28 . The method in accordance with  claim 27 , wherein the plurality of modes includes a high power mode and a power efficiency mode. 
     
     
         29 . The method in accordance with  claim 28 , the method further comprising switching from V min  to V max  when the temperature of the fluid is greater than a predetermined temperature (T w ).