High intensity light source

Abstract

A light source comprises a heat-sink having a mounting region, and heat-dissipating fins, a base housing having an inner cavity and coupled to the heat-sink, and an integrated lighting module including: a printed circuit board; an LED on a substrate coupled to the printed circuit board within a first lateral region of the printed circuit board, and an electronic driving circuit for providing power to the LED and coupled to the printed circuit board within a second lateral region of the printed circuit board, wherein a bottom surface of the substrate is thermally coupled to the mounting region of the heat-sink, and wherein the second lateral region of the integrated lighting module is located within the inner cavity of the base housing.

1 - 20 . (canceled) 
     
     
         21 . A light source comprising:
 a heat-sink comprising: an inner core region having an inner cavity configured to house electronic components and having a mounting region disposed within the inner core region shaped to accept a thermally conductive substrate;   an electrically insulating layer formed in direct contact with the thermally conductive substrate;   a light emitting source disposed on the electrically insulating layer, wherein a bottom surface of the light emitting source is mechanically and thermally coupled to the thermally conductive substrate, and wherein the thermally conductive substrate is mechanically and thermally coupled to the mounting region; and   an electronic driving circuit configured to provide electrical power to the light emitting source, wherein the electronic driving circuit is electrically coupled to light emitting source.   
     
     
         22 . The light source of  claim 21 , wherein,
 the bottom surface of the light emitting source disposed on the electrically insulating layer is mechanically and thermally coupled to the thermally conductive substrate via a thermally conductive epoxy; and   the thermally conductive substrate comprises aluminum.   
     
     
         23 . The light source of  claim 21 , further comprising a thermally-conductive compound, wherein the thermally-conductive compound is disposed between the thermally-conductive substrate and the heat-sink. 
     
     
         24 . The light source of  claim 21 , wherein,
 the electronic driving circuit is configured to receive an AC voltage and is configured to provide the electrical power to the light emitting source in response to the AC voltage; and   the electronic driving circuit comprises at least one resistor, at least one capacitor and at least one switching component.   
     
     
         25 . The light source of  claim 21 , wherein the light emitting source is electrically coupled to the electronic driving circuit using a solder-containing bond pad. 
     
     
         26 . The light source of  claim 25 , wherein the solder-containing bond pad is formed by a solder layer comprising tin. 
     
     
         27 . The light source of  claim 21 , comprising a base housing mechanically coupled to the heat sink, wherein the base housing comprises a GU 5.3 form factor compatible base. 
     
     
         28 . The light source of  claim 21 , wherein, the electronic components comprise a plurality of power pins; and
 the plurality of power pins is configured to receive an AC voltage from an external supply.   
     
     
         29 . The light source of  claim 21 , further comprising a lens mechanically-coupled to the heat-sink, wherein the lens is configured to transmit light output from the plurality of light emitting diodes. 
     
     
         30 . The light source of  claim 21 , wherein,
 the light emitting source comprises a plurality of light emitting diodes; and   the heat-sink comprises an MR- 16  compatible form factor.   
     
     
         31 . A spot light comprising:
 a heat-sink comprising an inner core region having an inner cavity configured to house electronic components and having a mounting region disposed within the inner core region shaped to accept a thermally conductive substrate;   an electrically insulating layer formed in direct contact with the thermally conductive substrate;   a light emitting source disposed on the electrically insulating layer wherein a bottom surface of the light emitting source is mechanically and thermally coupled to the thermally conductive substrate, and wherein the thermally conductive substrate is mechanically and thermally coupled to the mounting region; and   an electronic driving circuit configured to provide electrical power to the light emitting source, wherein the electronic driving circuit is electrically coupled to light emitting source.   
     
     
         32 . The spot light of  claim 31 , wherein,
 the bottom surface of the light emitting source disposed on the electrically insulating layer is mechanically and thermally coupled to the thermally conductive substrate via a thermally conductive epoxy; and   the thermally conductive substrate comprises aluminum.   
     
     
         33 . The spot light of  claim 31 , further comprising a thermally-conductive compound, wherein the thermally-conductive compound is disposed between the thermally-conductive substrate and the heat-sink. 
     
     
         34 . The spot light of  claim 31 , wherein,
 the electronic driving circuit is configured to receive an AC voltage and is configured to provide the electrical power to the light emitting source in response to the AC voltage; and   the electronic driving circuit comprises at least one resistor, at least one capacitor and at least one switching component.   
     
     
         35 . The spot light of  claim 31 , wherein the light emitting source is electrically coupled to the electronic driving circuit using a solder-containing bond pad. 
     
     
         36 . The spot light of  claim 35 , wherein the solder-containing bond pad is formed by a solder layer comprising tin. 
     
     
         37 . The spot light of  claim 31 , wherein,
 the electronic components comprise a plurality of power pins; and   the plurality of power pins is configured to receive an AC voltage from an external supply.   
     
     
         38 . The spot light of  claim 31 , wherein the light emitting source comprises a plurality of light emitting diodes. 
     
     
         39 . The spot light of  claim 31 , comprising a base housing mechanically coupled to the heat sink, wherein the base housing comprises a GU 5.3 form factor compatible base. 
     
     
         40 . A flood light comprising:
 a heat-sink comprising an inner core region having an inner cavity configured to house electronic components and having a mounting region disposed within the inner core region shaped to accept a thermally conductive substrate;   an electrically insulating layer formed in direct contact with the thermally conductive substrate;   a light emitting source disposed on the electrically insulating layer wherein a bottom surface of the light emitting source is mechanically and thermally coupled to the thermally conductive substrate, and wherein the thermally conductive substrate is mechanically and thermally coupled to the mounting region; and   an electronic driving circuit configured to provide electrical power to the light emitting source, wherein the electronic driving circuit is electrically coupled to light emitting source.