US2014313676A1PendingUtilityA1

Electronic component package

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Assignee: SAMSUNG ELECTRO MECHPriority: Mar 2, 2007Filed: Jul 1, 2014Published: Oct 23, 2014
Est. expiryMar 2, 2027(~0.6 yrs left)· nominal 20-yr term from priority
Inventors:Joon Seok KangSung YiJae-Cheon DohDo Jae YooSun-Kyong KimJong Hwan Baek
H10W 90/00H10W 72/9413H10W 72/877H10W 72/241H10W 72/073H10W 70/685H10W 70/682H10W 70/093H10W 70/60H10W 95/00H10W 70/614H10W 70/09H10W 40/22H10W 76/10H10W 40/28H05K 2201/066H05K 1/0203Y10T29/49146
48
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Claims

Abstract

An electronic component package includes: a first insulation layer; an electronic component mounted in one surface of the first insulation layer; a heat sink formed with a cavity corresponding to the electronic component, bonded to the one surface of the first insulation layer to cover the electronic component, and formed with an inset hole and with an inlet hole; an adhesive charged in the cavity; and a circuit pattern formed in another surface of the first insulation layer.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
         1 . An electronic component package, comprising:
 a first insulation layer;   an electronic component mounted in one surface of the first insulation layer;   a heat sink formed with a cavity corresponding to the electronic component, bonded to the one surface of the first insulation layer to cover the electronic component, and formed with an inset hole and with an inlet hole;   an adhesive charged in the cavity; and   a circuit pattern formed in another surface of the first insulation layer.   
     
     
         2 . The electronic component package of  claim 1 , wherein the inset hole and the inlet hole are formed in surfaces, respectively, facing each other. 
     
     
         3 . The electronic component package of  claim 1 , wherein the adhesive consists of a material including a thermal interface material (TIM). 
     
     
         4 . The electronic component package of  claim 1 , wherein the first insulation layer consists of a material including polyimide. 
     
     
         5 . The electronic component package of  claim 1 , further comprising a lay-up layer stacked in the other surface of the first insulation layer.

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