US2014312707A1PendingUtilityA1

Wireless energy transfer resonator enclosures

58
Assignee: WITRICITY CORPPriority: Sep 27, 2008Filed: Feb 27, 2014Published: Oct 23, 2014
Est. expirySep 27, 2028(~2.1 yrs left)· nominal 20-yr term from priority
Inventors:Ron FiorelloMorris P. KeslerAndre B. KursKonrad J. KulikowskiSteven J. Ganem
H01F 38/14H01F 2003/005H02J 50/12H02J 50/80H03H 7/40H02J 50/70H02J 50/90H02J 7/80H02J 7/62H02J 50/60H02J 50/005H02J 50/50H04B 5/79
58
PatentIndex Score
0
Cited by
0
References
0
Claims

Abstract

Described herein are improved configurations for a resonator enclosure for wireless high power transfer that includes a support plate, a sheet of good conductor positioned on one side of the support plate, a separator piece for maintaining a separation distance between the resonator and the sheet of good conductor, and a cover of a non-lossy material covering the resonator, the separator, the sheet of good conductor and attached to the support plate, wherein the size of the sheet of good conductor is larger than the size of the resonator.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
         1 . A resonator assembly for wireless high-power transfer, comprising:
 a sheet of high conductivity material, having a first side and a second side; and   a magnetic resonator comprising at least one inductive coupling element and at least one capacitor and having a resonant frequency;   wherein the at least one capacitor is positioned on the first side of the sheet of high conductivity material and the at least one inductive coupling element is positioned on the second side of the sheet of high conductivity material.   
     
     
         2 . The assembly of  claim 1 , wherein the high conductivity material comprises copper. 
     
     
         3 . The assembly of  claim 1 , wherein the high conductivity material comprises aluminum. 
     
     
         4 . The assembly of  claim 1 , wherein the high conductivity material is thicker than the skin depth of the conductor at the resonant frequency. 
     
     
         5 . The assembly of  claim 1 , wherein the high conductivity material is thicker than the skin depth of the conductor at the resonant frequency. 
     
     
         6 . The assembly of  claim 1 , wherein the high conductivity material is thicker than 0.25 mm. 
     
     
         7 . The assembly of  claim 1 , wherein the high conductivity material is thicker than 0.5 mm. 
     
     
         8 . The assembly of  claim 1 , wherein the magnetic resonator is a planar resonator. 
     
     
         9 . The assembly of  claim 1 , wherein the resonant frequency of the resonator is between 10 kHz and 100 MHz. 
     
     
         10 . The assembly of  claim 1 , wherein the resonant frequency of the resonator is between 10 kHz and 100 kHz. 
     
     
         11 . The assembly of  claim 1 , further comprising a separator piece positioned between the at least one inductive coupling element and the sheet of high conductivity material. 
     
     
         12 . A packaged resonator assembly for wireless high-power transfer, comprising:
 a resonator assembly, comprising a high conductivity material;   a printed circuit board comprising power and control circuitry;   a support plate; and   a cover, enclosing at least the resonator assembly and the printed circuit board;   wherein the high conductivity material is in substantial thermal contact with the support plate.   
     
     
         13 . The packaged resonator assembly of  claim 12 , further comprising components utilized to enable a safety system of a wireless power transfer system. 
     
     
         14 . The packaged resonator assembly of  claim 12 , further comprising components utilized to enable a control system of a wireless power transfer system. 
     
     
         15 . The packaged resonator assembly of  claim 12 , further comprising components utilized to enable a monitor system of a wireless power transfer system. 
     
     
         16 . The packaged resonator assembly of  claim 12 , further comprising components utilized to enable a billing system of a wireless power transfer system. 
     
     
         17 . The packaged resonator assembly of  claim 12 , further comprising at least one temperature sensor mounted on the printed circuit board. 
     
     
         18 . The packaged resonator assembly of  claim 12 , further comprising at least one voltage sensor mounted on the printed circuit board. 
     
     
         19 . The packaged resonator assembly of  claim 12 , further comprising at least one current sensor mounted on the printed circuit board. 
     
     
         20 . The packaged resonator assembly of  claim 12 , further comprising mounting components for mounting the resonator to the underside of a vehicle. 
     
     
         21 . The packaged resonator assembly of  claim 12 , further comprising connection components for connecting to a system of the vehicle. 
     
     
         22 . The packaged resonator assembly of  claim 21 , wherein the system of the vehicle comprises any of a cooling system or a heating system.

Join the waitlist — get patent alerts

Track US2014312707A1 — get alerts on status changes and closely related new filings.

We store only your email — no account needed. See our privacy policy.