Non-random array anisotropic conductive film (acf) and manufacturing processes

Abstract

Structures and manufacturing processes of an ACF array using a non-random array of microcavities of predetermined configuration, shape and dimension. The manufacturing process includes fluidic filling of conductive particles onto a substrate or carrier web comprising a predetermined array of microcavities, of selective metallization of the array followed by filling the array with a filler material and a second selective metallization on the filled microcavity array. The thus prepared filled conductive microcavity array is then over-coated or laminated with an adhesive film. Cavities in the array, and particles filling the cavities, can have a unimodal, bimodal, or multimodal distribution.

What is claimed is: 
     
         1 . A method for fabricating an electric device comprising:
 placing a plurality of conductive particles into an microcavity array of narrow cavity size distribution;   transferring the conductive particles from the microcavity array to an adhesive layer; and   disposing the conductive particles in predefined locations in the adhesive layer, and   wherein each microcavity of the microcavity array is shaped and sized to allow only one conductive particle to be entrapped in each microcavity of the microcavity array.   
     
     
         2 . The method of  claim 1 , wherein the conductive particles are narrowly dispersed particles have a mean particle diameter between about 2 um to about 6 um, and the narrowly dispersed particles have a diameter standard deviation of less than about 10% of the mean particle diameter. 
     
     
         3 . The method of  claim 2 , wherein the narrowly dispersed particles have a diameter standard deviation of no larger than about 5% of the mean particle diameter. 
     
     
         4 . The method of  claim 1 , further comprising:
 forming a curvature edge at the circular opening of a microcavity, wherein the curvature edge has a radius of between about 0 microns to about 10 microns.   
     
     
         5 . An electronic device comprising an electronic component connected with an anisotropic conductive film (ACF) wherein the ACF has non-random conductive particle array 
     
     
         6 . The electronic devices of  claim 5  wherein the electronic component comprises a display device. 
     
     
         7 . The electronic device of  claim 5  wherein the electronic device comprises a semiconductor chip. 
     
     
         8 . The electronic device of  claim 5  wherein the electronic device comprises a printed circuit. 
     
     
         9 . The electronic devices of  claim 8  wherein the electronic device comprises a flexible printed circuit. 
     
     
         10 . An ACF comprising an array of conductive particles and an adhesive layer, the conductive particles being arranged in a non-random array of predefined locations in the adhesive layer. 
     
     
         11 . The ACF of  claim 10  wherein the particles have a mean particle diameter between about 2 to 6 μm and the standard deviation of the particles is less than about 10%.