Hot Melt Adhesive System And Method Using Machine Readable Information

Abstract

A hot melt adhesive system includes a melting unit configured to liquefy a bulk form of hot melt adhesive and deliver the liquefied hot melt adhesive to an application location. The melting unit includes a controller for establishing and/or verifying at least one system condition, such as temperatures associated with system operation. A machine reading unit is coupled with the controller and is capable of receiving information from a machine readable element and communicating the information to the controller for use in establishing and/or verifying the system condition. A method of operating the system includes scanning information on at least one system condition into the controller from a machine readable element, and using the scanned information during operation of the melting unit.

1 - 4 . (canceled) 
     
     
         5 . A hot melt adhesive dispensing system, comprising:
 at least one adhesive dispensing module;   a dispensing unit for receiving and liquefying hot melt adhesive;   a heated hose operatively coupling said tank with said at least one adhesive dispensing module;   a controller operative to control the hot melt adhesive dispensing system to dispense hot melt adhesive; and   a machine reading unit associated with said controller and being operable to receive information from a machine readable element related to the operation of the hot melt adhesive dispensing system to dispense hot melt adhesive;   the information comprising one of:
 a) information about the hot melt adhesive, or 
 b) information about the hot melt adhesive dispensing system; 
   said controller using the received information to establish or verify a system operating condition for at least one of said dispensing unit, said hose, or said adhesive dispensing module   
     
     
         6 . The hot melt adhesive system of  claim 5 , wherein the machine readable element is an electronic chip and said machine reading unit is configured to receive information from the electronic chip. 
     
     
         7 . The hot melt adhesive system of  claim 5 , wherein the machine readable element is a bar code and said machine reading unit is configured to receive information from the bar code. 
     
     
         8 . The hot melt adhesive system of  claim 5 , wherein the machine readable element includes magnetic material and said machine reading unit is configured to receive information from the magnetic material. 
     
     
         9 . The hot melt adhesive system of  claim 5 , wherein the machine readable element includes a wireless device and said machine reading unit is configured to receive information from the wireless device. 
     
     
         10 . The hot melt adhesive system of  claim 5 , wherein the machine readable element includes a device that operates by radio frequencies and said machine reading unit is configured to receive information from the device. 
     
     
         11 . The hot melt adhesive system of  claim 5 , further comprising a keypad associated with said controller, said keypad operable to input information related to establishing or verifying system parameters or conditions. 
     
     
         12 . A hot melt adhesive dispensing system, comprising:
 a melting unit configured to liquefy a bulk form of hot melt adhesive, and to deliver the liquefied hot melt adhesive to an application location;   
       a controller; and
 a machine reading unit configured to receive information from a machine readable element and to communicate the information to said controller; 
 the information comprising one of:
 a) information about the hot melt adhesive, or 
 b) information about the hot melt adhesive dispensing system; 
 
 
       said controller using the information received from the machine reading unit to establish and/or verify a system operating condition of the hot melt adhesive dispensing system. 
     
     
         13 . The hot melt adhesive system of  claim 12 , wherein said machine reading unit comprises a bar code reader. 
     
     
         14 . The hot melt adhesive system of  claim 12 , wherein said machine reading unit comprises a magnetic strip reader. 
     
     
         15 . The hot melt adhesive system of  claim 12 , wherein said machine reading unit comprises an RF reader. 
     
     
         16 . The hot melt adhesive system of  claim 12 , wherein said system condition comprises an application temperature of the hot melt adhesive. 
     
     
         17 . The hot melt adhesive system of  claim 12 , wherein said system condition comprises an over-temperature condition of the hot melt adhesive. 
     
     
         18 . The hot melt adhesive system of  claim 12 , wherein said system condition comprises a set-back temperature condition of the hot melt adhesive. 
     
     
         19 . The hot melt adhesive system of  claim 12 , wherein said system condition comprises a warning associated with an operation of the system. 
     
     
         20 . The hot melt adhesive system of  claim 12 , wherein said system condition comprises a flushing operation of the system. 
     
     
         21 . A container of hot melt adhesive for supplying adhesive to a hot melt adhesive dispensing system, said container having a machine readable element affixed thereto, said machine readable element carrying information for establishing and/or verifying at least one condition for operating the hot melt adhesive system.