Semiconductor device and manufacturing method of semiconductor device

Abstract

A semiconductor device has a semiconductor substrate having a first surface and a second surface, a through electrode penetrating through the semiconductor substrate and having a protrusion protruding from the second surface, and an insulation layer on the second surface, which covers the side surface of the protrusion, has an opening through which to expose the end surface of the protrusion, and has a thickness greater than the length of the protrusion.

What is claimed is: 
     
         1 . A semiconductor device comprising:
 a semiconductor substrate having a first surface and a second surface;   a through electrode penetrating through the semiconductor substrate and having a protrusion protruding from the second surface; and   an insulation layer on the second surface, which covers a side surface of the protrusion, has an opening through which to expose an end surface of the protrusion, and has a thickness greater than the length of the protrusion.   
     
     
         2 . The semiconductor device according to  claim 1 , wherein
 the end surface has a shape concave toward the first surface.   
     
     
         3 . The semiconductor device according to  claim 1 , wherein
 the end surface has a flat shape.   
     
     
         4 . The semiconductor device according to  claim 1 , wherein
 the periphery of the opening is inclined toward the protrusion.   
     
     
         5 . The semiconductor device according to  claim 1 , wherein
 the semiconductor substrate has an element layer on the first surface.   
     
     
         6 . A semiconductor device comprising:
 a first semiconductor substrate having a first surface and a second surface;   a through electrode penetrating through the first semiconductor substrate and having a protrusion protruding from the second surface;   an insulation layer on the second surface, which covers a side surface of the protrusion, has an opening through which to expose an end surface of the protrusion, and has a thickness greater than the length of the protrusion; and   a second semiconductor substrate having a bump, wherein   the second semiconductor substrate is laminated on the first semiconductor substrate so that the bump comes into contact with the end surface.   
     
     
         7 . A manufacturing method of a semiconductor device comprising:
 forming an electrically conductive layer extending from a first surface of a semiconductor substrate toward the side of a third surface up to part of the way;   forming a protrusion by forming a second surface by processing the semiconductor substrate from the side of the third surface to reduce the thickness of the semiconductor substrate and by protruding part of the electrically conductive layer from the second surface;   covering the protrusion by forming an insulation layer having a thickness greater than the length of the protrusion on the second surface; and   forming an opening in the insulation layer, through which to expose an end surface of the protrusion, by reducing the thickness of the insulation layer and also processing the insulation layer and the protrusion so that the length of the protrusion becomes less than the thickness of the insulation layer.   
     
     
         8 . The manufacturing method of a semiconductor device according to  claim 7 , wherein
 the processing the insulation layer and the protrusion processes the protrusion so that the end surface becomes concave toward the side of the first surface of the semiconductor substrate.   
     
     
         9 . The manufacturing method of a semiconductor device according to  claim 7 , wherein
 the processing the insulation layer and the protrusion processes the protrusion so that the end surface becomes flat.   
     
     
         10 . The manufacturing method of a semiconductor device according to  claim 7 , wherein
 the processing the insulation layer and the protrusion processes the insulation layer so that the periphery of the opening inclines toward the protrusion.   
     
     
         11 . The manufacturing method of a semiconductor device according to  claim 7 , wherein
 the processing the insulation layer and the protrusion comprises:
 processing first the insulation layer so that the thickness of the insulation layer is reduced until the protrusion is exposed; and 
 processing second the protrusion so that the length of the protrusion becomes less than the thickness of the insulation layer. 
   
     
     
         12 . The manufacturing method of a semiconductor device according to  claim 11 , wherein
 the processing first has grinding or polishing.   
     
     
         13 . The manufacturing method of a semiconductor device according to  claim 12 , wherein
 the polishing of the processing first uses slurry having any of abrasive grains including colloidal silica, an organic acid including a chelating agent, a citric acid, or an oxalic acid, an additive including ammonia water, potassium hydroxide, or a hydrogen peroxide solution, and a non-ionic detergent including polyethylene glycol.   
     
     
         14 . The manufacturing method of a semiconductor device according to  claim 11 , wherein
 the processing second has a first processing rate for the semiconductor substrate and a second processing rate for the electrically conductive layer, and   the second processing rate is higher than the first processing rate.   
     
     
         15 . The manufacturing method of a semiconductor device according to  claim 11 , wherein
 the processing second has polishing or etching.   
     
     
         16 . The manufacturing method of a semiconductor device according to  claim 15 , wherein
 the polishing of the processing second uses slurry comprising any of abrasive grains including colloidal silica, an organic acid including a citric acid, an oxalic acid, or a malic acid, an amino acid including glycine, and an additive including ammonia water, a hydrogen peroxide solution, a nitric acid, or benzotriazole.   
     
     
         17 . The manufacturing method of a semiconductor device according to  claim 15 , wherein
 the etching of the processing second is wet etching using a hydrogen peroxide solution, a hydrofluoric acid, a nitric acid, a sulfuric acid, or a mixed solution thereof.   
     
     
         18 . The manufacturing method of a semiconductor device according to  claim 7 , wherein
 before the processing the electrically conductive layer, an element layer is formed on the first surface of the semiconductor substrate.