Light emitting diode package

Abstract

An exemplary light emitting diode package includes a substrate, a first electrode and a second electrode embedded in the substrate, and a light emitting chip fixed onto the first electrode by first glue. The first electrode has a first barrier member at a periphery of the first glue and below the light emitting chip. The first barrier member obstructs the first glue from spreading toward a side of the first barrier member away from the first glue and the light emitting chip, whereby a contamination by the first glue to an area of the top surface beside the side of the first barrier of the first electrode away from the first glue and the light emitting chip is prevented.

What is claimed is: 
     
         1 . A light emitting diode package, comprising:
 a substrate;   a first electrode and a second electrode spaced from each other and embedded in the substrate; and   a light emitting chip fixed onto the first electrode by first glue under the light emitting chip, and the light emitting chip electrically connecting with the first electrode and the second electrode by two wires respectively;   wherein the first electrode has a first barrier member having a side adjacent to the first glue and the light emitting chip, the first barrier member is located below the light emitting chip, and the first barrier member is formed to obstruct the first glue from spreading towards another side of the first barrier member away from the light emitting chip and the first glue.   
     
     
         2 . The light emitting diode package of  claim 1 , wherein the first barrier member is a receiving slot defined in a periphery of the first glue to receive the first glue flowing toward the first barrier member. 
     
     
         3 . The light emitting diode package of  claim 2 , wherein the receiving slot is an elongated rectangular slot, and a depth of the receiving slot is less than a thickness of the first electrode. 
     
     
         4 . The light emitting diode package of  claim 3 , wherein a length of an opening of the receiving slot is larger than a width of the glue, and is less than a length of the first electrode. 
     
     
         5 . The light emitting diode package of  claim 2  further comprising a zener diode fixed onto the second electrode by second glue under the zener diode, and the zener diode electrically connecting with the first and second electrodes, wherein the zener diode is electrically connected with the first electrode by a wire. 
     
     
         6 . The light emitting diode package of  claim 5 , wherein the zener diode is in inverse parallel connection with the light emitting diode. 
     
     
         7 . The light emitting diode package of  claim 5 , wherein the first glue is made of electrically insulating material and the second glue is made of electrically conductive material. 
     
     
         8 . The light emitting diode package of  claim 5 , wherein the second electrode has a second barrier member to obstruct the second glue from spreading toward a side of the second barrier member away from the zener diode. 
     
     
         9 . The light emitting diode package of  claim 8 , wherein the second barrier member is a blocking wall located at a periphery of the second glue. 
     
     
         10 . The light emitting diode package of  claim 8 , wherein the second barrier member is a receiving slot defined in the second electrode and located at a periphery of the second glue, and a depth of the second barrier member is less than a thickness of the second electrode. 
     
     
         11 . The light emitting diode package of  claim 10 , wherein a length of the second barrier member is larger than a width of the second glue, and the length of the second barrier member is less than a length of the second electrode. 
     
     
         12 . The light emitting diode package of  claim 1 , wherein the first barrier member is a blocking wall located at a periphery of the first glue. 
     
     
         13 . The light emitting diode package of  claim 12 , wherein a length of the first barrier member is larger than a width of the first glue. 
     
     
         14 . The light emitting diode package of  claim 13 , wherein a height of the first barrier member is larger than a thickness of the first glue. 
     
     
         15 . The light emitting diode package of  claim 12  further comprising a zener diode fixed onto the second electrode by second glue under the zener diode, and the second electrode has a second barrier member to obstruct the second glue from spreading toward a side of the second barrier member away from the zener diode. 
     
     
         16 . The light emitting diode package of  claim 15 , wherein the second barrier member is a receiving slot defined in the second electrode and located at a periphery of the second glue. 
     
     
         17 . The light emitting diode package of  claim 15 , wherein the second barrier member is a blocking wall formed on the second electrode at a periphery of the second glue. 
     
     
         18 . The light emitting diode package of  claim 17 , wherein a height of the second barrier member is larger than a thickness of the second glue. 
     
     
         19 . The light emitting diode package of  claim 15 , wherein the first glue is made of electrically insulating material and the second glue is made of electrically conductive material.