Heat dissipation device

Abstract

A heat dissipation device for placing on a heating element is disclosed. The heat dissipation device includes a base and a plurality of fin assemblies. The base includes a plurality of slots. Each fin assembly includes a fixed portion and a fin portion connected to the fixed portion. The fixed portion is capable of inserting into one of the slots to combine the fin assembly with the base. The fin portion includes a plurality of fins, and an interval is between the two adjacent fins. A largest length of each fin is less than one tenth of a wavelength of a noise frequency generated by the fin assembly.

What is claimed is: 
     
         1 . A heat dissipation device, located on a heating element, the heat dissipation device comprising:
 a base, comprising a plurality of slots; and   a plurality of fin assemblies, each of the fin assemblies comprising a fixed portion and a fin portion; the fin portion being connected to the fixed portion, and the fixed portion being capable of inserting into one of the plurality of slots to combine the fin assembly with the base; the fin portion comprising a plurality of fins, an interval being formed between the two adjacent fins, and a largest length of each of the fins is less than one tenth of a wavelength of a noise frequency generated by the fin assembly.   
     
     
         2 . The heat dissipation device as claimed in  claim 1 , wherein the wavelength of the noise frequency generated by the fin assembly is obtained via a formula: 
       
         
           
             
               λ 
               = 
               
                 
                   
                     CX 
                     c 
                   
                    
                   
                     ( 
                     
                       2 
                        
                       πɛ 
                        
                       
                           
                       
                        
                       A 
                     
                     ) 
                   
                 
                 d 
               
             
           
         
         wherein λ is the wavelength the of noise frequency generated by the fin assembly; C is a light speed; X c  is a capacitive reactance generated by a contacting surface between the base and the heating element; ∈ is a dielectric constant of a thermal material located between the base and the heating element; A is a contacting area between the base and the heating element; d is a distance from the base to the contacting surface of the heating element. 
       
     
     
         3 . The heat dissipation device as claimed in  claim 1 , wherein each of the slots comprises at least one opening end, and the fin assembly is inserted into the slot along a locating direction which is substantially horizontal from any one of the opening ends of the slot. 
     
     
         4 . The heat dissipation device as claimed in  claim 3 , wherein each of the slots comprises an opening part and a containing part; a section width of the opening part which is substantially vertical to the locating direction, is less than a section width of the fixed portion of the containing part which is substantially vertical to the locating direction. 
     
     
         5 . The heat dissipation device as claimed in  claim 4 , wherein a section width of the fixed portion of the fin assembly which is vertical to the locating direction, is corresponded to a section width of the containing part which is vertical to the locating direction; a section width of the fin portion of the fin assembly which is vertical to the locating direction, is corresponded to a second section width of the opening part which is vertical to the locating direction. 
     
     
         6 . The heat dissipation device as claimed in  claim 5 , further comprising a ground element, the ground element comprising a ground end and a combining end, and the base further comprising at least one corresponding junction, wherein the combining end of the ground element is connected to one of the at least one corresponding junction of the base, and the ground end is connected to a ground plane. 
     
     
         7 . The heat dissipation device as claimed in  claim 6 , wherein the at least one corresponding junction is at least one chute, and each of the chutes is located on one side of the base; each chute comprises at least one opening end, for combining with the combining end of the ground element; the combining end of the ground element can optionally move to any position along the chute. 
     
     
         8 . The heat dissipation device as claimed in  claim 7 , wherein each of the chutes further comprises a first groove and a second groove connected to the first groove, and an angle is formed between the second groove and the first groove; the combining end of the ground element comprises a first member corresponding to the first groove and a second member corresponding to the second groove, and the second member is connected to the first member and the angle is formed between the second member and the first member. 
     
     
         9 . The heat dissipation device as claimed in  claim 6 , wherein the ground end of the ground element is fastened to the ground plane via screwing or inserting. 
     
     
         10 . The heat dissipation device as claimed in  claim 6 , wherein the combining end forms a hooking, and the at least one corresponding junction is a plurality of combining holes located around the base; the combining end of the ground element can be optionally connected to any one of the combining holes for changing a locating position of the ground element. 
     
     
         11 . The heat dissipation device as claimed in  claim 1 , further comprising a ground element, the ground element comprising a ground end and a combining end, and the base further comprising at least one corresponding junction, wherein the combining end of the ground element is connected to one of the at least one corresponding junction of the base, and the ground end is connected to a ground, plane. 
     
     
         12 . The heat dissipation device as claimed in  claim 11 , wherein the at least one corresponding junction is at least one chute, and each of the chutes is located on one side of the base; each chute comprises at least one opening end, for combining with the combining end of the ground element; the combining end of the ground element can optionally move to any position along the chute. 
     
     
         13 . The heat dissipation device as claimed in  claim 12 , wherein each of the chutes further comprises a first groove and a second groove connected to the first groove, and an angle is formed between the second groove and the first groove; the combining end of the ground element comprises a first member corresponding to the first groove and a second member corresponding to the second groove, and the second member is connected to the first member and the angle is formed between the second member and the first member. 
     
     
         14 . The heat dissipation device as claimed in  claim 11 , wherein the ground end of the ground element is fastened to the ground plane via screwing or inserting. 
     
     
         15 . The heat dissipation device as claimed in  claim 11 , wherein the combining end forms a hooking, and the at least one corresponding junction is a plurality of combining holes located around the base; the combining end of the ground element can be optionally connected to any one of the combining holes for changing a locating position of the ground element.