Chemical mechanical polishing conditioner

Abstract

The present invention (utility model application in Taiwan) relates to a chemical mechanical polishing pad dresser, comprising: a substrate; a bonding layer disposed on the substrate; an electroplating layer disposed on the bonding layer; a fixed template disposed on the electroplating layer having a plurality of apertures; and a plurality of abrasive particles corresponding to and set in the apertures, wherein the plurality of abrasive particle fixed in the bonding layer and the substrate by means of the electroplating layer. Therefore, the present invention is not only to avoid damaging the abrasive particles due to the high temperature heating in the production process, but also to solve the corrosion problem of the surface of the chemical mechanical polishing pad dresser by the fixed template and the electroplating layer and to solve simultaneously the pollution problem generating on the polished workpieces by using conventional brazing bonding layer; and, the present invention can also provide to adjust the abrasive particles arrangement and protrude rate through the fixed template, so as to enhance the grinding performance and quality of the chemical mechanical polishing pad dresser.

What is claimed is: 
     
         1 . A chemical mechanical polishing pad dresser, comprising:
 a substrate;   a bonding layer disposed on the substrate;   an electroplating layer disposed on the bonding layer;   a fixed template disposed on the electroplating layer having a plurality of apertures; and   a plurality of abrasive particles corresponding to and set in the apertures, wherein the plurality of abrasive particles are fixed with the bonding layer and the substrate by the electroplating layer.   
     
     
         2 . The chemical mechanical polishing pad dresser as claimed in  claim 1 , wherein the plurality of abrasive particles are synthetic diamond, natural diamond, polycrystalline diamond, cubic boron nitride, or polycrystalline cubic boron nitride. 
     
     
         3 . The chemical mechanical polishing pad dresser as claimed in  claim 1 , wherein the particle size of the plurality of abrasive particles are greater than the inner diameter of the apertures. 
     
     
         4 . The chemical mechanical polishing pad dresser as claimed in  claim 1 , wherein the size of the plurality of abrasive particles is from 100 microns to 600 microns. 
     
     
         5 . The chemical mechanical polishing pad dresser as claimed in  claim 1 , wherein the protrude rate that the abrasive particles protrude from the fixed template is ⅕ to ½ of the size of the abrasive plurality of particles. 
     
     
         6 . The chemical mechanical polishing pad dresser as claimed in  claim 1 , wherein the plurality of abrasive particles have a pattern arrangement. 
     
     
         7 . The chemical mechanical polishing pad dresser as claimed in  claim 1 , wherein the fixed template is made from nickel metal, silver metal, copper, or alloys thereof. 
     
     
         8 . The chemical mechanical polishing pad dresser as claimed in  claim 7 , wherein the thickness of the fixed template is from 50 microns to 300 microns. 
     
     
         9 . The chemical mechanical polishing pad dresser as claimed in  claim 1 , wherein the bonding layer is made from brazing materials, electroplating materials, a ceramic material or a resin material. 
     
     
         10 . The chemical mechanical polishing pad dresser as claimed in  claim 9 , wherein the thickness of the bonding layer is from 20 microns to 200 microns. 
     
     
         11 . The chemical mechanical polishing pad dresser as claimed in  claim 1 , wherein the substrate is made from stainless steel. 
     
     
         12 . The chemical mechanical polishing pad dresser as claimed in  claim 1 , wherein the highest tips of the plurality of abrasive particles are connected to form a polishing surface, wherein the polishing surface is a plane, a convex plane, or a concave plane. 
     
     
         13 . The chemical mechanical polishing pad dresser as claimed in  claim 1 , wherein the plurality of abrasive particles respectively have an attitude with a tip oriented toward a polishing pad to be dressed. 
     
     
         14 . The chemical mechanical polishing pad dresser as claimed in  claim 1 , wherein the plurality of abrasive particles located in the central area respectively have an attitude with a tip oriented toward a polishing pad to be dressed, and the plurality of abrasive particles located in the surrounding area have an attitude with a plane oriented toward the polishing pad to be dressed. 
     
     
         15 . The chemical mechanical polishing pad dresser as claimed in  claim 1 , wherein the diameter of the substrate is from 5 mm to 250 mm. 
     
     
         16 . The chemical mechanical polishing pad dresser as claimed in  claim 1 , further comprising a base substrate disposed on the bottom of the substrate, wherein an adhesive layer for adjusting thickness is sandwiched between the substrate and the base substrate. 
     
     
         17 . The chemical mechanical polishing pad dresser as claimed in  claim 16 , wherein the surface of the base substrate has a plurality of substrates. 
     
     
         18 . The chemical mechanical polishing pad dresser as claimed in  claim 16 , wherein the diameter of the base substrate is 4 to 20 times of the diameter of the substrates. 
     
     
         19 . The chemical mechanical polishing pad dresser as claimed in  claim 16 , further comprising a sealing layer filled in the gap between the substrates, wherein the substrate is fixed to the base substrate. 
     
     
         20 . The chemical mechanical polishing pad dresser as claimed in  claim 16 , wherein the diameter of the substrate is 10 mm to 20 mm.