Valve Reseating

Abstract

Some embodiments comprise an apparatus for reseating valves, where an eccentric, non-rotational motion is applied in a grinding or lapping process. Other embodiments comprise a micrometer that permits repeatable application of pressure against a plate when the apparatus is removed and reinstalled. In yet other embodiments, levered arms provide an expedient mechanism for positioning a reseating apparatus.

What is claimed is: 
     
         1 . An apparatus, comprising:
 a spindle substantially centered about a rotational axis; and   a swivel mechanically coupled to the spindle, the swivel being located axially off center of the rotational axis.   
     
     
         2 . The apparatus of  claim 1 , further comprising:
 a plate mounted on the swivel, the plate being located axially off center of the rotational axis.   
     
     
         3 . The apparatus of  claim 1 , the plate exhibiting eccentric, non-rotational motion when torque is applied to the spindle, the non-rotational motion including an angular advancement. 
     
     
         4 . The apparatus of  claim 2 , further comprising:
 an abrasive mechanically coupled to the plate, the abrasive being located axially off center of the rotational axis.   
     
     
         5 . The apparatus of  claim 2 , further comprising:
 a spring mechanically coupled to the plate, the spring for applying pressure to the plate.   
     
     
         6 . The apparatus of  claim 1 , the swivel comprising a universal joint. 
     
     
         7 . The apparatus of  claim 1 , further comprising:
 means for securely holding the apparatus perpendicular to a plane of a valve seat.   
     
     
         8 . The apparatus of  claim 1 , further comprising:
 means for applying a torque to the spindle.   
     
     
         9 . The apparatus of  claim 1 , further comprising:
 means for centering the apparatus with reference to a valve.   
     
     
         10 . An apparatus, comprising:
 levered arms for securely holding the apparatus perpendicular to a grinding plane;   a spindle substantially centered about a rotational axis, the rotational axis being substantially perpendicular to the grinding plane; and   an adjustment wheel mechanically coupled to the levered arms, the adjustment wheel for adjusting the levered arms.   
     
     
         11 . The apparatus of  claim 10 , further comprising:
 jaws attached to the levered arms, the jaws for mounting the apparatus to a valve.   
     
     
         12 . The apparatus of  claim 11 , the adjustment wheel further for moving the jaws radially outward from the rotational axis. 
     
     
         13 . The apparatus of  claim 11 , further comprising:
 a swivel mechanically attached to the spindle, the swivel being located axially off center of the rotational axis; and   a plate mounted on the swivel, the plate being located axially off center of the rotational axis.   
     
     
         14 . The apparatus of  claim 11 , the levered arms for centering the rotational axis with reference to the valve. 
     
     
         15 . The apparatus of  claim 10 , further comprising:
 means for grinding in an eccentric, non-rotational motion with advance.   
     
     
         16 . An apparatus, comprising:
 a spindle substantially centered about a rotational axis;   a plate mechanically coupled to the swivel;   a spring mechanically coupled to the plate, the spring for applying pressure to the plate; and   a micrometer assembly mechanically coupled to the spindle, the micrometer assembly further being mechanically coupled to the spring, the micrometer assembly for controlling movement of the assembly parallel to the rotational axis.   
     
     
         17 . The apparatus of  claim 16 , the micrometer assembly comprising a micrometer dial, the micrometer dial for indicating a relative position of the spindle with reference to a grinding surface. 
     
     
         18 . The apparatus of  claim 17 , the micrometer assembly further comprising a lock knob for securing the apparatus at a fixed micrometer dial setting. 
     
     
         19 . The apparatus of  claim 16 , further comprising:
 means for grinding in an eccentric and non-rotational motion, the non-rotational motion including an angular advancement.   
     
     
         20 . The apparatus of  claim 16 , further comprising:
 means for applying a torque to the spindle.