Toy building block with embedded integrated circuit
Abstract
A toy building block of a type which may be interconnected with similarly configured blocks has a hollow box-shaped structure having a top with cylindrical stud coupling members, and sides which together with the top define a downwardly opening cavity into which the cylindrical studs of a like configured block may be inserted for frictional interconnection. One or more integrated circuit chips are embedded within the molding material of the block, and leads incorporated within the block studs and sides provide electrical interconnection between blocks when like configured blocks are brought into frictional interengagement. In a described embodiment, components of a digital video recording system are apportioned to different blocks which when interconnected provide the complete system functionality.
Claims
exact text as granted — not AI-modified1 . (canceled)
2 . (canceled)
3 . A toy building block, comprising:
a hollow box-shaped structure made of molded thermoplastic material, including a top and sides, primary coupling members in the form of cylindrical studs located at evenly-spaced positions in a regular array on the top, and a downwardly opening cavity defined by inside surfaces of the top and sides; the studs and cavity being relatively configured and dimensioned so that the block may be frictionally engaged with another like block by inserting the studs of one of the blocks into the cavity of the other; one or more integrated circuit (IC) chips embedded within the molded structure, wherein at least one IC provides image capture; and leads incorporated within the molded structure dimensioned, configured and positioned so that when the block is frictionally engaged with the another like block electrical connection of the leads of one of the blocks will be established with the leads of the other.
4 . The toy building block of claim 3 , wherein the leads are dimensioned, configured and positioned so that leads exposed on studs of the one block will frictionally engage with leads exposed in the cavity studs of the another block.
5 . The toy building block of claim 3 , wherein the leads are configured to allow at least two separate electrical connections to a stud of another building block.
6 . The toy building block of claim 3 , wherein image capture includes video.
7 . A toy building block, comprising:
a hollow box-shaped structure made of molded thermoplastic material, including a top and sides, primary coupling members in the form of cylindrical studs located at evenly-spaced positions in a regular array on the top, and a downwardly opening cavity defined by inside surfaces of the top and sides; the studs and cavity being relatively configured and dimensioned so that the block may be frictionally engaged with another like block by inserting the studs of one of the blocks into the cavity of the other; one or more integrated circuit (IC) chips embedded within the molded structure, wherein at least one IC provides wireless communication; and leads incorporated within the molded structure dimensioned, configured and positioned so that when the block is frictionally engaged with the another like block electrical connection of the leads of one of the blocks will be established with the leads of the other.
8 . The toy building block of claim 7 , wherein the leads are dimensioned, configured and positioned so that leads exposed on studs of the one block will frictionally engage with leads exposed in the cavity studs of the another block.
9 . The toy building block of claim 7 , wherein the leads are configured to allow at least two separate electrical connections to a stud of another building block.
10 . A toy building block, comprising:
a hollow box-shaped structure made of molded thermoplastic material, including a top and sides, primary coupling members in the form of cylindrical studs located at evenly-spaced positions in a regular array on the top, and a downwardly opening cavity defined by inside surfaces of the top and sides; the studs and cavity being relatively configured and dimensioned so that the block may be frictionally engaged with another like block by inserting the studs of one of the blocks into the cavity of the other; one or more integrated circuit (IC) chips embedded within the molded structure, wherein at least one IC is an infrared transceiver; and leads incorporated within the molded structure dimensioned, configured and positioned so that when the block is frictionally engaged with the another like block electrical connection of the leads of one of the blocks will be established with the leads of the other.
11 . The toy building block of claim 10 , wherein the leads are dimensioned, configured and positioned so that leads exposed on studs of the one block will frictionally engage with leads exposed in the cavity studs of the another block.
12 . The toy building block of claim 10 , wherein the leads are configured to allow at least two separate electrical connections to a stud of another building block.Join the waitlist — get patent alerts
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