High Density Digital Signal Cross-Connect System

Abstract

A telecommunication panel may comprise a chassis configured to receive insertable Digital Signal Cross-connect (DSX) modules and a backplane connected to the chassis. The DSX module is compact to fit into the telecommunication panel. A ratio of the number of the insertable 6-port DSX modules over the backplane surface area at least about 0.37 modules per square inch is achieved. The DSX module may include a printed circuit board and a light emitting diode (LED) light pipe on the printed circuit board to minimize the width of the DSX module. The DSX module may be inserted into the telecommunication panel horizontally or vertically so that the telecommunication panel receives a maximum number of DSX modules.

1 . (canceled) 
     
     
         2 . A Digital Signal Cross-connect (DSX) module comprising:
 a module face;   a substrate having a front opposite a back, the front of the substrate connected to the module face;   one or more jacks mounted at the front of the substrate;   a light emitting diode (LED) on the substrate a distance behind the one or more jacks away from the module face;   a cover lens disposed in the module face; and   a light pipe interposed between the LED and the cover lens to transmit light from the LED to the module face.   
     
     
         3 . The DSX module of  claim 2 , wherein the substrate comprises a substantially planar printed circuit board. 
     
     
         4 . The DSX module of  claim 2 , wherein the light pipe is disposed parallel to the printed circuit board. 
     
     
         5 . The DSX module of  claim 2 , further comprising a Deutsches Institut für Normung (DIN) connector mounted to the printed circuit board. 
     
     
         6 . The DSX module of  claim 2 , wherein at least one of the one or more jacks comprises a mini-WECO jack. 
     
     
         7 . The DSX module of  claim 2 , wherein the one or more jacks comprises at least six jacks. 
     
     
         8 . A telecommunication module comprising:
 a module face;   a substantially planar printed circuit board (PCB) connected to the module face;   a set of jacks on the module face;   a light emitting diode (LED) disposed on the PCB and recessed a distance behind the set of jacks away from the module face; and   a light pipe extending the distance from the module face to the LED disposed on the PCB to transmit light from the LED to the module face.   
     
     
         9 . The telecommunication module of  claim 8 , further comprising a designation card on the module face. 
     
     
         10 . The telecommunication module of  claim 9 , further comprising a fastener on the module face, and wherein the designation card is arranged on the fastener. 
     
     
         11 . The telecommunication module of  claim 8 , further comprising a cover lens disposed in the module face, and wherein the light pipe extends from the cover lens disposed in the module face to the LED disposed on the PCB the distance behind the set of jacks away from the module face. 
     
     
         12 . The telecommunication module of  claim 8 , further comprising a Deutsches Institut fur Normung (DIN) connector mounted to the PCB. 
     
     
         13 . The telecommunication module of  claim 8 , wherein at least one of the set of jacks comprises a mini-WECO jack. 
     
     
         14 . The telecommunication module of  claim 8 , wherein the set of jacks comprises at least six jacks. 
     
     
         15 . A Digital Signal Cross-connect (DSX) module comprising:
 a substantially planar module face having a length greater than a width;   a plurality of jack receiving apertures formed in the module face and arranged along on the length of the module face;   a plurality of jacks, each jack received in one of the plurality of jack receiving apertures;   a light emitting diode (LED) disposed a distance behind the set of jacks away from the module face; and   a light pipe extending the distance from the module face to the LED disposed the distance behind the set of jacks to transmit light from the LED to the module face.   
     
     
         16 . The DSX module of  claim 15 , further comprising a fastener arranged on a first end of the module face opposite a second end of the module face, the fastener to removeably couple the DSX module to a chassis, and
 a cover lens disposed in the module face between the fastener and the set of jacks received in the plurality of jack receiving apertures.   
     
     
         17 . The DSX module of  claim 16 , wherein the light pipe extends from the cover lens disposed in the module face to the LED disposed the distance behind the set of jacks away from the module face. 
     
     
         18 . The DSX module of  claim 15 , wherein the plurality of jack receiving apertures comprises at least six jack receiving apertures arranged along on the length of the module face, and wherein the plurality of jacks comprises at least six jacks received in the six jack receiving apertures. 
     
     
         19 . The DSX module of  claim 18 , wherein at least one of the six jacks comprises a mini-WECO jack. 
     
     
         20 . The DSX module of  claim 15 , further comprising a substantially planar printed circuit board (PCB) connected to the module face with the PCB being substantially perpendicular to the module face. 
     
     
         21 . The DSX module of  claim 20 , further comprising a Deutsches Institut für Normung (DIN) connector mounted to the PCB.