Three-dimensional adhesive device having a microelectronic system embedded therein
Abstract
A three-dimensional adhesive device to be attached to the body surface of a mammal including a microelectronic sensing system. The system includes (a) a three-dimensional adhesive body made of a pressure sensitive adhesive having an upper surface and a bottom surface; (b) a microelectronic system embedded in the body of the pressure sensitive adhesive; (c) one or more cover layer(s) attached to the upper surface; and (d) optionally a release liner releasably attached to the bottom surface. Suitably the microelectronic system is capable of sensing physical input such as pressure, vibration, sound, electrical activity (e.g. from muscle activity), tension, blood-flow, moisture, temperature, enzyme activity, bacteria, pH, blood sugar, conductivity, resistance, capacitance, inductance or other chemical, biochemical, biological, mechanical or electrical purposes.
Claims
exact text as granted — not AI-modified1 . A sensor assembly adapted to be attached to the body surface of a mammal, comprising:
a sensor circuit including a plurality of electrical components; an adhesive device including at least one power source for powering at least one of said plurality of electrical components and at least one adhesive for attaching the sensor assembly to the body surface of a mammal; and said adhesive device being adapted to be releasably connected to the sensor circuit.
2 . The sensor assembly according to claim 1 , wherein the sensor circuit is at least partially contained in a housing, said housing being formed of a proximal housing part and a distal housing part.
3 . The sensor assembly according to claim 2 , wherein a recess is formed in the distal housing part, the recess being adapted to receive the at least one power source, the adhesive is applied to the distal side of the housing and the distal side of the at least one power source, and a first peel force between the adhesive and the housing is smaller than a second peel force between the adhesive and the at least one power source.
4 . The sensor assembly according to claim 3 , wherein at least one transducer is attached to a proximal surface of the proximal part.
5 . The sensor assembly according to claim 2 , wherein at least one transducer is attached to a proximal surface of the proximal part.
6 . The sensor assembly according to claim 3 , wherein at least one electrical contact is provided in the distal housing part providing electrical connection between the at least one power source and the electrical components.
7 . The sensor assembly according to claim 2 , wherein at least one electrical contact is provided in the distal housing part providing electrical connection between the at least one power source and the electrical components.Join the waitlist — get patent alerts
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