Building board and method for producing building board

Abstract

A building board includes an inorganic board having a surface covered by an insulating coating film containing a coating film forming material and organic hollow particles, wherein the organic hollow particles have an average particle size in the range of 5 to 50 μm and an average hollow ratio of 80% or more, and the insulating coating film contains 0 01 to 5.0 parts by mass of the organic hollow particles per 100 parts by mass of solid content thereof, and has an average thickness of 5 to 500 μm. The method for producing a building board includes: applying, onto a surface of an inorganic board, an insulating coating material containing a coating film forming material and organic hollow particles; and drying the insulating coating material to form an insulating coating film.

What is claimed is: 
     
         1 . A building board comprising an inorganic board having a surface covered by an insulating coating film containing a coating film forming material and organic hollow particles,
 wherein the organic hollow particles have an average particle size in the range of 5 to 50 μm and an average hollow ratio of 80% or more, and   the insulating coating film contains 0.01 to 5.0 parts by mass of the organic hollow particles per 100 parts by mass of solid content thereof, and has an average thickness of 5 to 500 μm.   
     
     
         2 . The building board according to  claim 1 ,
 wherein the insulating coating film is formed as an outermost layer in the building board.   
     
     
         3 . The building board according to  claim 1 ,
 wherein the organic hollow particles comprise at least one of acrylonitrile, methacrylonitrile, vinylidene chloride, acrylic acid ester, and styrene.   
     
     
         4 . The building board according to  claim 1 ,
 wherein the insulating coating film contains a water-soluble solvent.   
     
     
         5 . The building board according to  claim 4 ,
 wherein the water-soluble solvent comprises at least one of a glycol-based solvent and a glycol ether-based solvent.   
     
     
         6 . The building board according to  claim 1 ,
 wherein the inorganic board is a ceramic siding board.   
     
     
         7 . A method for producing a building board, comprising: applying, onto a surface of an inorganic board, an insulating coating material containing a coating film forming material and organic hollow particles; and drying the insulating coating material to form an insulating coating film,
 wherein a coating material containing 0.01 to 5.0 parts by mass of organic hollow particles having an average particle size in the range of 5 to 50 μm and an average hollow ratio of 80% or more, per 100 parts by mass of solid content of the coating material is used as the insulating coating material, and   the coating material is dried such that the insulating coating film has an average thickness of 5 to 500 μm.   
     
     
         8 . The method for producing a building board according to  claim 7 ,
 wherein the insulating coating film is formed on an outermost side in the building board.   
     
     
         9 . The method for producing a building board according to  claim 7 ,
 wherein the organic hollow particles comprise at least one of acrylonitrile, methacrylonitrile, vinylidene chloride, acrylic acid ester, and styrene.   
     
     
         10 . The method for producing a building board according to  claim 7 ,
 wherein the insulating coating material contains a water-soluble solvent.   
     
     
         11 . The method for producing a building board according to  claim 10 ,
 wherein the water-soluble solvent comprises at least one of a glycol-based solvent and a glycol ether-based solvent.   
     
     
         12 . The method for producing a building board according to  claim 7 ,
 wherein a ceramic siding board is used as the inorganic board.