Oscillator

Abstract

An oscillator that can suppress a solder crack caused by a temperature change by a simple structure at low cost and improve heat cycle resistance performance is provided. The oscillator includes an epoxy resin board and an electronic component mounted on the board. Two-terminal electrode patterns are formed on the board, and connected to terminal electrodes of the electronic component by solder. A projection is formed on each of the electrode patterns at a part connected to a corresponding terminal electrode to create a space between the terminal electrode and the electrode pattern, and the solder forms a fillet in the space. This contributes to enhanced adhesion strength of the solder.

1 - 20 . (canceled) 
     
     
         21 . An oscillator including an epoxy resin board and an electronic component mounted on the board, comprising:
 an electrode pattern formed on the board;   a solder resist formed so as to partially cover the electrode pattern on a side closer to a center of the electronic component; and   mount solder for solder-connecting the electrode pattern and a component electrode formed at an end of the electronic component, in a state where the electronic component is lifted by the electrode pattern and the solder resist to create a space between the electrode pattern and the component electrode.   
     
     
         22 . The oscillator according to  claim 21  applied to an oven controlled crystal oscillator. 
     
     
         23 . A manufacturing method of an oscillator including an epoxy resin board and an electronic component mounted on the board, comprising:
 forming an electrode pattern on the board;   forming a solder resist so as to partially cover the electrode pattern on a side closer to a center of the electronic component;   applying solder onto the electrode pattern;   mounting the electronic component on the solder resist; and   solder-connecting the electrode pattern and a component electrode formed at an end of the electronic component by reflow, in a state where the electronic component is lifted by the electrode pattern and the solder resist to create a space between the electrode pattern and the component electrode.   
     
     
         24 . An oscillator including an epoxy resin board and a circuit component mounted on the board, comprising:
 two-terminal electrode patterns formed on the board and solder-connected to terminal electrodes of the circuit component;   a projection formed on each of the electrode patterns at a part of contact with a corresponding terminal electrode; and   solder applied onto the electrode pattern,   wherein a tip of the projection contacts the terminal electrode, and the solder is filled in a space between the electrode pattern and the terminal electrode and, as a result of reflow after the circuit component is mounted, forms a fillet between the electrode pattern and a side surface of the terminal electrode.   
     
     
         25 . The oscillator according to  claim 24 , wherein the projection is formed on the electrode pattern on a side closer to the other electrode pattern facing the electrode pattern. 
     
     
         26 . The oscillator according to  claim 24 , wherein the solder forms the fillet in a space on the electrode pattern where the projection is not formed. 
     
     
         27 . The oscillator according to  claim 24 , wherein a plurality of projections are provided on each of the electrode patterns. 
     
     
         28 . The oscillator according to  claim 24 , wherein the two-terminal electrode patterns are arranged so that a direction in which the electrode patterns face each other matches a direction in which the board has a smallest linear expansion coefficient. 
     
     
         29 . The oscillator according to  claim 24  applied to an oven controlled crystal oscillator. 
     
     
         30 . An oscillator including an epoxy resin board and an electronic component mounted on the board, comprising:
 an electrode land pattern formed on the board;   a dummy land pattern formed on the board where the electronic component is mounted;   a solder resist formed so as to cover the dummy land pattern;   a silk print layer formed so as to cover the solder resist; and   mount solder for solder-connecting the electrode land pattern and a component electrode formed at an end of the electronic component, in a state where the electronic component is lifted by the dummy land pattern, the solder resist, and the silk print layer to create a space between the electrode land pattern and the component electrode.   
     
     
         31 . The oscillator according to  claim 24  applied to an oven controlled crystal oscillator. 
     
     
         32 . A manufacturing method of an oscillator including an epoxy resin board and an electronic component mounted on the board, comprising:
 forming an electrode land pattern on the board and a dummy land pattern on the board where the electronic component is to be mounted;   forming a solder resist so as to cover the dummy land pattern;   forming a silk print layer so as to cover the solder resist;   applying solder onto the electrode land pattern;   mounting the electronic component on the silk print layer; and   solder-connecting the electrode land pattern and a component electrode formed at an end of the electronic component by reflow, in a state where the electronic component is lifted by the dummy land pattern, the solder resist, and the silk print layer to create a space between the electrode land pattern and the component electrode.